基于FBG在线监测的环氧树脂封装材料的固化过程

doi:10.11901/1005.3093.2017.551

材料研究学报

2018, Vol. 32

Issue (10): 737-742 DOI: 10.11901/1005.3093.2017.551

研究论文

本期目录 | 过刊浏览

基于FBG在线监测的环氧树脂封装材料的固化过程

高琳琳¹, 张雷达¹, 王庆林¹, 叶慧¹, 万国顺¹, 姜明顺², 贾玉玺¹(

)

1 山东大学材料科学与工程学院济南 250061
2 山东大学控制科学与工程学院济南 250061

Curing Behavior of Epoxy Resin Packaging Material Based on FBG Online Monitoring Technique

Linlin GAO¹, Leida ZHANG¹, Qinglin WANG¹, Hui YE¹, Guoshun WAN¹, Mingshun JIANG², Yuxi JIA¹(

)

1 School of Materials Science and Engineering, Shandong University, Jinan 250061, China
2 School of Control Science and Engineering, Shandong University, Jinan 250061, China

引用本文:

高琳琳, 张雷达, 王庆林, 叶慧, 万国顺, 姜明顺, 贾玉玺. 基于FBG在线监测的环氧树脂封装材料的固化过程[J]. 材料研究学报, 2018, 32(10): 737-742.
Linlin GAO, Leida ZHANG, Qinglin WANG, Hui YE, Guoshun WAN, Mingshun JIANG, Yuxi JIA. Curing Behavior of Epoxy Resin Packaging Material Based on FBG Online Monitoring Technique[J]. Chinese Journal of Materials Research, 2018, 32(10): 737-742.

全文: PDF(1242 KB) HTML

摘要:

使用光纤布拉格光栅(Fiber Bragg Grating, FBG)传感器实时在线监测电子封装用液态环氧树脂固化过程中的温度和应变,以及在同一模具内相同水平高度、不同位置处(FBG传感器所测)的温度和应变随固化时间的演变,研究了环氧树脂用量对树脂固化过程中温度和应变演变的影响。结果表明：在环氧树脂固化过程中模腔内同一水平高度、不同位置处的应变-时间曲线和温度-时间曲线有很好的一致性,说明在环氧树脂的固化过程中温度和应变响应与水平位置无关;同时,在FBG传感器埋入位置固定的前提下,树脂固化过程中的温度最大值和树脂完全固化后的最终残余应变都随着环氧树脂用量的增加而增大。

关键词 ：高分子材料, 环氧树脂, FBG在线监测, 固化反应, 电子封装

Abstract：

During curing process, the temperature and strain of liquid epoxy resin, which was used for electronic packaging, were online monitored by fiber Bragg grating (FBG) sensors. The evolution of the temperature and strain with the curing time was measured by FBG sensors in the same mould for various desired spots, where locate at the same height but different positions. Besides, under the same experimental condition, the effect of the epoxy resin dosage on the temperature- and strain-evolution was also examined. The results show that during the curing process, the strain-time and the temperature-time curves for the epoxy resin at the same height but different positions have good consistency, which means that the temperature and strain responses during the curing process of the epoxy resin are independent of the horizontal position. In addition, for fixed embedded positions of FBG sensors, both of the maximum temperature during the curing process and the final residual strain after curing increase with the increasing dosage of epoxy resin.

Key words： polymer materials epoxy resin FBG online monitoring curing reaction electronic packaging

收稿日期: 2017-09-18

ZTFLH:

TB324

基金资助:国家自然科学基金(51373090),国防重点基础科研(JCKY2016205B007),工信部民机专项(MJ-2015-H-G-103),山东大学基本科研业务费专项资金(2016JC012)

作者简介:

作者简介高琳琳,女,1991年生,硕士生

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https://www.cjmr.org/CN/10.11901/1005.3093.2017.551 或 https://www.cjmr.org/CN/Y2018/V32/I10/737

图1 FBG传感器封装结构

图2 FBG传感器铺设示意图

表1 实验用FBG传感器的参数

图3 FBG传感器的反射光谱图

图 4 FBG1和FBG3测得的温度和应变随时间的演变

图5 FBG3测得的温度和应变随时间的演变

图6 FBG1和 FBG2测得的温度和应变随时间的演变

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