磨粒刮擦诱导单晶镍微结构演化与塑性去除行为的纳观分析

doi:10.11901/1005.3093.2021.166

材料研究学报

2022, Vol. 36

Issue (7): 511-518 DOI: 10.11901/1005.3093.2021.166

研究论文

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磨粒刮擦诱导单晶镍微结构演化与塑性去除行为的纳观分析

陈晶晶¹(

), 邱小林², 李柯¹, 袁军军¹, 周丹¹, 刘亦薇¹

^1.南昌理工学院机电工程学院南昌 330044
^2.南昌理工学院江西省光电材料重点实验室南昌 330044

Microstructure Evolution and Plastic Removal for Single Crystal Nickel Induced by Particle Scratching: Atomic Simulation Method

CHEN Jingjing¹(

), QIU Xiaolin², LI Ke¹, YUAN Junjun¹, ZHOU Dan¹, LIU Yiwei¹

^1.School of Mechanical and Electrical Engineering, Nanchang Institute of Technology, Nanchang 330044, China
^2.College of Electrical and Mechanical Engineering, Key Laboratory of Optoelectronic Material of Jiangxi Province, Nanchang 330044, China

引用本文:

陈晶晶, 邱小林, 李柯, 袁军军, 周丹, 刘亦薇. 磨粒刮擦诱导单晶镍微结构演化与塑性去除行为的纳观分析[J]. 材料研究学报, 2022, 36(7): 511-518.
Jingjing CHEN, Xiaolin QIU, Ke LI, Junjun YUAN, Dan ZHOU, Yiwei LIU. Microstructure Evolution and Plastic Removal for Single Crystal Nickel Induced by Particle Scratching: Atomic Simulation Method[J]. Chinese Journal of Materials Research, 2022, 36(7): 511-518.

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摘要:

基于分子动力学模拟,从原子水平研究了单晶镍刮擦诱导的微结构演变和塑性去除,重点分析了不同晶面的微结构演变特征和塑性去除差异,阐明了在滑动刮擦和滚动刮擦工况下塑性的去除规律,揭示了微结构演化和塑性去除的机制。结果表明,在紧密接触区产生的应力集中不仅是单晶镍位错滑移的源动力,而且是FCC结构向HCP结构转变和材料塑性去除产生磨屑的主因。发生磨粒刮擦时Ni(110)晶面出现最大的水平切向力,磨粒刮擦时在Ni(110)晶面内形成了具有水平滑移特征的HCP结构,其中位错滑移是其磨屑比Ni(100)和Ni(111)晶面多的主因。在同等刮擦条件下,Ni(110)晶面的塑性环脱落行为滞后。同时,密排堆垛层错行为和磨损表面的剪切应变都表现出显著的晶面选择性。与滑动刮擦相比,滚动刮擦时镍原子显著地粘附于磨粒的外表面,是切向力在刮擦过程中大幅度振荡的主要原因。

关键词 ：金属材料, 单晶镍, 微结构演化, 塑性环, 原子模拟, 塑性去除

Abstract：

The microstructure evolution and plastic removal induced by particle scratching for single crystal nickel were investigated by means of molecular dynamics simulation at the atomic level, meanwhile, the characteristics of microstructure evolution and the difference of plastic removal of different crystal surfaces were analyzed. The results show that the stress concentration in the close contact zone is not only the motivity for dislocation slip of single crystal nickel, but also the main cause of the transition from FCC structure to HCP structure and the plastic removal of the material. During abrasive particle scraping, the maximum horizontal tangential force appears on the Ni(110) crystal surface, correspondingly, the HCP structure with horizontal slip characteristics may form in the Ni(110) crystal plane, as a result, the dislocation slip may mainly be responsible to that the quantity of debris on the Ni(100) plane is more than that on the Ni(111) plane. Therefore, by the same level of particle scraping, the hysteresis of plastic ring abscission on Ni(110) crystal surface may emerge. At the same time, both the occurrence of stacking fault and the shear strain of the worn surface show remarkable crystal facet selectivity. Compared with the case of sliding scraping, the nickel atoms adhere to the outer surface of the abrasive particles significantly during rolling scraping, which is the main reason for the large oscillation of the tangential force during the scraping process.

Key words： metallic materials nickel substrate mmicro-structure evolution plastic loop atomic simulation plastic removal

收稿日期: 2021-03-05

ZTFLH:

TH117

基金资助:南昌理工学院机械表/界面摩擦磨损与防护润滑校级研究中心及江西省教育厅科学技术研究项目(GJJ212101);南昌理工学院机械表/界面摩擦磨损与防护润滑校级研究中心及江西省教育厅科学技术研究项目(GJJ219310);南昌市重点实验室建设项目(2020-NCZDSY-005)

作者简介: 陈晶晶,男,1989年生,硕士

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图1 刚性磨粒刮擦单晶镍的纳观物理模型

表1 MD模拟参数的设置

图2 滑动距离为8 nm时不同晶面的剪切应变

图3 在不同温度下Ni(111)晶面刮擦诱导的剪切应变

图4 镍单晶的不同晶面以及在不同温度下的磨屑数量和切向力随滑动距离的变化

图5 在不同温度下经磨粒刮擦后单晶镍的径向分布函数、在滑动和滚动作用下切向力的演化以及滚动刮擦距离为1.2 nm和6 nm时的磨粒形貌

图6 刮擦诱导的单晶镍不同晶面微结构的演变

图7 单晶镍不同晶面刮擦后微结构的演化

图8 刮擦后镍单晶不同晶面的塑性变形和材料去除

图9 不同晶面的HCP原子占比和(HCP+Other)总原子占比随刮擦距离的变化

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