材料研究学报  2013, Vol. 27 Issue (2): 202-206

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在低合金钢基体表面沉积镶嵌结构界面金刚石膜*

余 1 邱万奇1 潘建伟1 周克崧1, 2

1. 华南理工大学材料科学与工程学院 广州 510640 2. 广州有色金属研究院新材料研究所 广州 510650

Preparation of Inlay Structure Diamond Films on Low-alloy Steel Substrate

YU Yun1 QIU Wanqi1** PAN Jianwei1 ZHOU Kesong1,2

1. School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640 2. New Materials Research Department, Guangzhou Research Institute of Non-ferrous Metals, Guangzhou 510640

余, 邱万奇, 潘建伟, 周克崧. 在低合金钢基体表面沉积镶嵌结构界面金刚石膜*[J]. 材料研究学报, 2013, 27(2): 202-206.
YU Yun, QIU Wanqi, PAN Jianwei, ZHOU Kesong. Preparation of Inlay Structure Diamond Films on Low-alloy Steel Substrate[J]. Chinese Journal of Materials Research, 2013, 27(2): 202-206.

摘要 参考文献 相关文章 Metrics 全文: PDF(3708 KB)   摘要: 在低合金钢基体上磁控溅射镀Cr/Cu双层膜, 电沉积铜-金刚石复合过渡层, 在热丝CVD系统中沉积了连续的金刚石膜。用压痕实验研究了所沉积的金刚石膜/基结合性能, 用扫描电镜(SEM)、X射线(XRD)、拉曼光谱表征了金刚石膜的表面形貌、相结构和内应力。结果表明, 经CVD金刚石沉积后Cr层转化为铬铁碳化物层, 阻止了Fe对界面金刚石的石墨化, 并部分缓冲相变应力; 较软的Cu层能有效缓解相变应力和热应力, 降低了所沉积的金刚石膜内应力; 用441 N载荷对所沉积的金刚石膜进行压痕评估, 压痕外缘只产生环状裂纹, 表明膜基结合力较高。 关键词 ： 无机非金属材料,  金刚石,  钢铁,  镶嵌,  结合力     Abstract： The diamond films were successfully fabricated on low-alloy steel substrate with Cr+Cu-Diamond interlayer deposited by magnetron sputtering for Cr/Cu and composite electroplating for Cu-diamond. The interfacial characteristics were investigated by indentation test and the surface morphology, phase structure and residual stress were analyzed by scanning electron microscopy (SEM), X-ray diffraction (XRD) and Raman spectroscopy. The results show that the Cr layer on low-alloy substrate prevents Fe from diffusing to Cu/diamond interface effectively by converting into (Cr, Fe)3C2 and (Cr, Fe)7C3 in CVD diamond growth. 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