等离子体聚对二甲苯的制备及其应用

材料研究学报

2010, Vol. 24

Issue (4): 353-357

研究论文

本期目录 | 过刊浏览

等离子体聚对二甲苯的制备及其应用

张治红, 豆君, 牛晓霞, 闫福丰, 彭东来, 郑先君

河南省表界面重点实验室郑州轻工业学院材料与化工学院郑州 450002

The Preparation and Application of Plasma Polymerized Paraxylene

ZHANG Zhihong, DOU Jun, Niu Xiaoxia, YAN Fufeng, PENG Donglai, ZHENG Xianjun

Henan Provincial Key Laboratory of Surface & Interface Science, Zhengzhou University of Light Industry, Zhengzhou 450002

引用本文:

张治红豆君牛晓霞闫福丰彭东来郑先君. 等离子体聚对二甲苯的制备及其应用[J]. 材料研究学报, 2010, 24(4): 353-357.
, , , , , . The Preparation and Application of Plasma Polymerized Paraxylene[J]. Chin J Mater Res, 2010, 24(4): 353-357.

全文: PDF(932 KB)

摘要:

在研究等离子聚合法所合成的聚对二甲苯(ppPX)薄膜的化学结构和性能的基础上, 考察了ppPX作为铜在Si--SiLK基体上阻隔层的应用可能性。在特定辉光射频条件下, ppPX膜表面的苯环能够保留。加热退火后, 铜向裸Si--SiLK和向经ppPX接枝修饰的Si--SiLK基体的扩散程度存在差异。经由Ar和N₂载气所承载的对二甲苯单体所聚合得到的ppPX, 具有不同的结构和性能, 后者能改善铜和聚合物膜间的粘附力。因此, 在Si--SiLK基底表面制备ppPX膜, 可提高铜在基体上的粘附强度, 又能阻隔铜向内基体内扩散。

关键词 ：有机高分子材料 , 等离子体聚合 , 聚对二甲苯 , 扩散隔离 , 低介电常数

Abstract：

Plasma graft polymerization of para–xylene (ppPX) on argon plasma–pretreated porous SiLK films coated Si(100) wafers (Si–SiLK) and retardation of copper diffusion on ppPX are investigated in the present work. The topography of the ppPX grafted Si–SiLK (Si–SiLK–g–ppPX) surfaces was analyzed by atomic force microscopy. X–ray photoelectron spectroscopy and fourier transform infrared spectroscopy results show that the benzene rings of ppPX can be retained to a large extent under a certain grow discharge conditions. Field emission scanning electron microscopy reveals the extent of copper diffusion into the pristine and graft–modified Si–SiLK substrates after thermal annealing. Since para–xylene monomers were introduced with argon (Ar) and nitrogen (N2), the different chemical structures of two kinds of ppPX are achieved and it is found that nitrogen could improve the adhesion between copper and the polymer film. Therefore, ppPX surface prepared on Si–SiLK wafers surface can serve a promising adhesion promotion layer and a diffusion barrier for copper.

Key words： organic polymer materials plasma polymerization para–xylene diffusion barrier low–electronic constant

收稿日期: 2010-04-29

ZTFLH:

TB324

基金资助:

国家自然科学基金20704039、河南省高校科技创新人才支持计划2010HASTIT023和河南省国际科技合作计划094300510078资助项目。

	服务

	把本文推荐给朋友
	加入引用管理器
	E-mail Alert
	RSS
	作者相关文章
	张治红
	闫福丰
	豆君
	牛晓霞
	彭东来
	郑先君
44.8K

链接本文:

https://www.cjmr.org/CN/ 或 https://www.cjmr.org/CN/Y2010/V24/I4/353

[1] K. Derbyshire, Fueling the productivity engine, Solid State Technol.,.41(2), 57(1998) [2] Semiconductor Industry Association, National Technology Roadmap for Semiconductors, International SEMATECH, Austin, TX(1999) [3] D.H. Zhang, S.W. Loh, C.Y. Li, R. Liu, A.T.S. Wee, L. Zhang, Y.K.Lee, P.D. Foo, Study of Cu diffusion in Cu/TaN/SiO2/Si multilayer structures, Sur. Rev. Lett., 8(5), 527(2001) [4] Y.K. Lee, K. Maung Latt, K. JaeHyung, T. Osipowicz, K. Lee, Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2, Mater. Sci. Eng., B, 68(2), 99(1999) [5] S. Q. Wang, S. Suthar, C. Hoeflichm, and B. J. Burrow, Diffusion barrier properties of TiW between Si and Cu, J. Appl. Phys., 73(5), 2301(1993) [6 ] V. M. Dubin, Y. Shacham Diamand, B. Zhao, P. K. Vasudev, and C. H. Ting, Selective and blanket electroless copper deposition for ultralarge scale integration, J.Electrochem. Soc., 144(3), 898(1997) [7] Y. Okinaka and T. Osaka, in Advances in Electrochemical Science and Engineering, Vol. 3, H. Gerischer and C. W. Tobias, Editors, VCH, Weinheim.55(1994). [8] Yao-Yi Cheng, Jiuq Yi Kan, I-Shun Lin, Adhesion studies of low-k silsesquioxane. Thin Solid Films, 462–463, 297(2004) [9] T.K. Goh, T.K.S. Wong, Investigation of structure, thermal and oxygen plasma stability of mesoporous methylsilsesquioxane films by X-ray reflectivity and small angle scattering. Microelectronic Engineering, 75(3), 33(2004) [10] M. Morgen, E. T. Ryan, J. H. Zhao, C. Hu, T. Cho, and P. S. Ho, Low dielectric constant materials for ULSI interconnects, Annu. Rev. Mater.Sci., 30, 645(2000) [11] P. Springer, Semicond. Int., 17, 52(1994) [12] C. Feger and H. Franke, in Polyimides: Fundamentals and Applications, M. K. Ghosh and K. L. Mittal, Editors, Marcel Dekker, New York, 759(1996), [13] N. Aoi, Novel porous films having low dielectric constants synthesized by liquid phase silylation of spin-on glass sol for intermetal dielectrics, Jpn. J. Appl. Phys., Part 1, 36, 1355(1997) [14] K. L. Fang and B. Y. Tsui, Metal drift induced electrical instability of porous low dielectric constant film, J. Appl. Phys., 93(9), 5546(2003) [15] P. H. Townsend, S. J. Martin, J. Godschalx, D. R. Romer, D. W. Smith, Jr., D.Castillo, R. DeVries, G. Buske, N. Rondan, S. Froelicher, J. Marshall, E. O. Shaffer,and J. H. Im, Materials Research Society symposia proceedings. Mater. Res. Soc. Symp. Proc., 476, 9(1997) [16] D. A. Babb, D. W. Smith, Jr., S. J. Martin, and J. P. Godschalx (Inventors), World Patent WO 97/10193, The Dow Chemical Company(1997) [17] S. J. Martin, J. P. Godschalx, M. E. Mills, E. O. Shaffer, and P. H. Townsend, Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect. Advanced Materials, 12, 1769( 2000) [18] S Saravanan1, C Joseph Mathai1, S Venkatachalam and M R Anantharaman1, Low k thin films based on rf plasma-polymerized aniline. New Journal of Physics, 6, 64(2004) [19] Renate Fo¨rch, Zhihong Zhang, Wolfgang Knoll, Soft Plasma Treated Surfaces: Tailoring of Structure and Properties for Biomaterial Applications, Plasma Process. Polym., 2(5), 351(2005) [20] G. J. Kovacs and P. S. Vincett, Formation and thermodynamic stability of a novel class of useful materials: Close-packed monolayers of submicron monodisperse spheres just below a polymer surface. J. Colloid Interface Sci., 90(2), 335(1982) [21] J.G.Wang, K.G. Neoh, K.T. Kang, Comparative study of chemically synthesized and plasma polymerized pyrrole and thiophene thin films . Thin Solid Films, 446(2) ,205(2004)

[1]	叶姣凤, 王飞, 左洋, 张钧翔, 罗晓晓, 冯利邦. 兼具高强度、高韧性和自修复性能的环氧树脂改性热可逆聚氨酯[J]. 材料研究学报, 2023, 37(4): 257-263.
[2]	李瀚楼, 焦晓光, 朱欢欢, 赵晓欢, 矫庆泽, 冯彩虹, 赵芸. 支链含氟聚酯的合成和性能[J]. 材料研究学报, 2023, 37(4): 315-320.
[3]	马逸舟, 赵秋莹, 杨路, 裘进浩. 热塑型聚酰亚胺/聚偏氟乙烯全有机复合薄膜的制备及其介电储能[J]. 材料研究学报, 2023, 37(2): 89-94.
[4]	殷洁, 胡云涛, 刘慧, 杨逸霏, 王艺峰. 基于电沉积技术构建聚苯胺/海藻酸膜及电化学性能研究[J]. 材料研究学报, 2022, 36(4): 314-320.
[5]	申延龙, 李北罡. 磁性氨基酸功能化海藻酸铝凝胶聚合物的制备及对偶氮染料的超强吸附[J]. 材料研究学报, 2022, 36(3): 220-230.
[6]	龙庆, 王传洋. 不同碳黑含量PMMA的热降解行为和动力学分析[J]. 材料研究学报, 2022, 36(11): 837-844.
[7]	蒋平, 吴丽华, 吕太勇, José Pérez-Rigueiro, 王安萍. 蜘蛛大壶状腺丝的反复拉伸力学行为和性能[J]. 材料研究学报, 2022, 36(10): 747-759.
[8]	鄢俊, 杨进, 王涛, 徐桂龙, 李朝晖. 有机硅油改性水性酚醛的制备及其性能[J]. 材料研究学报, 2021, 35(9): 651-656.
[9]	张昊, 李帆, 常娜, 王海涛, 程博闻, 王攀磊. 羧酸型接枝淀粉吸附树脂的制备和对染料的去除性能[J]. 材料研究学报, 2021, 35(6): 419-432.
[10]	孙丽颖, 钱建华, 赵永芳. AgNWs-TPU/PVDF柔性薄膜电容传感器的制备和性能[J]. 材料研究学报, 2021, 35(6): 441-448.
[11]	唐开元, 黄洋, 黄湘舟, 葛颖, 李娉婷, 袁凡舒, 张威威, 孙东平. 碳化细菌纤维素的理化性质及其在甲醇电催化中的应用[J]. 材料研究学报, 2021, 35(4): 259-270.
[12]	苏晨文, 张婷玥, 郭丽伟, 李乐, 杨苹, 刘艳秋. 用于模拟细胞外基质的硫醇-烯水凝胶的制备[J]. 材料研究学报, 2021, 35(12): 903-910.
[13]	张向阳, 章奇羊, 汤涛, 郑涛, 柳浩, 刘国金, 朱海霖, 朱海峰. 基于MOFs的复合材料制备及其对亚甲基蓝染料的吸附性能[J]. 材料研究学报, 2021, 35(11): 866-872.
[14]	万里鹰, 肖洋, 张伦亮. 基于热可逆Diels-Alder动态共价键PU-DA体系的制备和性能[J]. 材料研究学报, 2021, 35(10): 752-760.
[15]	张翠歌, 胡良, 卢祖新, 周佳慧. 基于海藻酸自组装胶体粒子的制备及其乳化性能[J]. 材料研究学报, 2021, 35(10): 761-768.

Viewed

Full text

Abstract

Cited

Shared

Discussed