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Si3N4/Ti/Cu/Ni二次部分瞬间液相连接 |
陈铮(1); 楼宏青(2); 李志章(3) |
1.华东船舶工业学院; 2.华南理工大学; 3.浙江大学 |
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引用本文:
陈铮; 楼宏青; 李志章 . Si3N4/Ti/Cu/Ni二次部分瞬间液相连接[J]. 材料研究学报, 1999, 13(3): 313-316.
1Y.Iino, J.Mater.Sci.Lett., 10, 104(1990) 2Y.Iino, H.Usami, M.0shimoda, T.Satio, The First Pacific Rim International Condrence on Advanced Ma-terialS and Pmeessiny (PRICM-1), 243(1992) 3G.Cecone, M.G.Nicholas, S.D.Petever, A.P.Tomsia, B.J.Oalgleish, A.M.Glaeser, Acta.Mater., 44(2),657(1996) 4M.L.Shalz, B.J.Dalgleish, A.P.Tomsia, A.M.Glaeser, J.Mater.Sci., 29, 3200(1994) 5H.Mastumot0, M.R.Locatelli, K.Nakashima, A.M.Glaeser, K.Mori, Mate .nans.JIM., 36(4), 555(1995) 6M.G.Nicholas, Joining of Ceramics (Chapman and Hall, 1990) P.124 7Hyoung Keun Lee, Jai Young Lee, J.mater.Sci., 31, 4133(1996) 8洗爱平,金属-陶瓷界面的润湿和结合机制,博士论文,中国科学院金属研究所(1991) 9陈辞,周飞,李志章,楼宏青,赵其章,硅酸盐学报,26(1),33(1998) 10Isaac Tuah-Poku, M.Dollar, T.B.Massalski, Metall.nans., 19A(3), 665(1988) |
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