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| 交变电流对60 nm厚纳米晶铜互连线变形失效行为的影响 |
| 张金钰; 赵义; 刘刚; 张敬; 孙军 |
| 西安交通大学 金属材料强度国家重点实验室 西安 710049 |
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| The Effects of Alternating Current on Deformation and Failure of 60 nm–thick Nanocrystalline Cu Lines |
| ZHANG Jinyu; ZHAO Yi; LIU Gang; ZHANG Jing; SUN Jun |
| State Key Laboratory for Mechanical Behavior of Materials; Xi'an Jiaotong University; XI'an 710049 |
引用本文:
张金钰 赵义 刘刚 张敬 孙军. 交变电流对60 nm厚纳米晶铜互连线变形失效行为的影响[J]. 材料研究学报, 2010, 24(2): 129-136.
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The Effects of Alternating Current on Deformation and Failure of 60 nm–thick Nanocrystalline Cu Lines[J]. Chin J Mater Res, 2010, 24(2): 129-136.
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