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材料研究学报  2021, Vol. 35 Issue (8): 615-622    DOI: 10.11901/1005.3093.2020.408
  研究论文 本期目录 | 过刊浏览 |
PSn-9Zn-0.1S无铅钎料性能的影响
李玲妹1, 黄惠珍1(), 张青环1, 帅歌旺2
1.南昌大学材料科学与工程学院 南昌 330031
2.南昌航空大学航空制造工程学院 南昌 330063
Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder
LI Lingmei1, HUANG Huizhen1(), ZHANG Qinghuan1, SHUAI Gewang2
1.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China
2.School of Aeronautical Manufacturing Engineering, Nanchang HangKong University, Nanchang 330063, China
引用本文:

李玲妹, 黄惠珍, 张青环, 帅歌旺. PSn-9Zn-0.1S无铅钎料性能的影响[J]. 材料研究学报, 2021, 35(8): 615-622.
Lingmei LI, Huizhen HUANG, Qinghuan ZHANG, Gewang SHUAI. Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder[J]. Chinese Journal of Materials Research, 2021, 35(8): 615-622.

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摘要: 

为研究P含量对Sn-9Zn-0.1S钎料显微组织、抗氧化性、润湿性及耐腐蚀性能的影响,通过光学显微镜观察钎料的显微组织,采用静态刮渣法测定钎料在不同温度下的抗氧化性能,用润湿铺展面积评价不同温度下钎料在Cu基板上的润湿性,采用腐蚀失重法衡量钎料在pH值为3.7的HCl溶液中的耐腐蚀性,并通过扫描电镜(SEM)和X射线衍射仪(XRD)对钎料在不同温度下的氧化产物和酸性腐蚀条件下形成的腐蚀产物进行形貌观察和物相分析。结果表明:适量P的添加可以细化Sn-9Zn-0.1S钎料层片状共晶组织,但短棒状富Zn相随P的添加而变长、变粗且数量减少;钎料的抗氧化性及润湿性能随P的添加先提高后降低,P含量在0.06%时钎料的抗氧化性及润湿性最好;同时,P通过改善钎料显微组织及腐蚀产物的致密性,提高了钎料的耐腐蚀性能,P含量在0.1%时钎料的耐腐蚀性能较好。

关键词 金属材料Sn-9Zn-0.1S无铅钎料抗氧化性润湿性耐腐蚀性    
Abstract

The effect of P addition on the microstructure, oxidation resistance, wettability and corrosion resistance of Sn-9Zn-0.1S solder alloy were characterized via optical microscope observation, scanning electron microscopy (SEM) and X-ray diffractometer (XRD), as well as dross removal measurement at different temperatures, spreading area on Cu plate and weight loss measurement after immersion in HCl solution respectively. The results show that P addition can refine the lamellar eutectic microstructures, but coarsen the rod-like primary Zn-rich phases. The oxidation resistance and wettability of the solder can be firstly increased with the addition of P, then this effect reduces, and the optimal P content is 0.06% (mass fraction). At the same time, a suitable amount of P addition can also improve the corrosion resistance of Sn-9Zn-0.1S solder alloy by modifying its microstructure and increasing the density of corrosion products. It is found that the weight loss is the minimum when the P content is 0.1% (mass fraction).

Key wordsmetallic materials    Sn-9Zn-0.1S lead-free solder    oxidation resistance    wettability    corrosion resistance
收稿日期: 2020-09-27     
ZTFLH:  TG425  
基金资助:江西省自然科学基金(20181BAB206010)
作者简介: 李玲妹,女,1996年生,硕士生
图1  SnZn-0.1S-xP钎料的光学显微组织
图2  SnZn-0.1S-xP钎料合金的XRD图谱
图3  不同温度下P含量对SnZn-0.1S钎料产生氧化渣量的影响
图4  320℃下SnZn-0.1S-xP钎料所产生氧化渣的XRD图谱
图5  SnZn-0.1S-xP钎料合金在320℃下形成的氧化层表面SEM像
AlloyPointSnZnO
SnZn-0.1Sα146.969.7543.29
SnZn-0.1Sα247.538.3244.15
SnZnS-0.15Pα347.5710.9741.46
SnZnS-0.15Pα445.1414.4240.44
SnZnS-0.15Pα519.4532.4648.05
SnZnS-0.15Pα613.7236.9149.37
表1  图5中所示各点处元素原子百分比
图6  不同温度下P含量对SnZn-0.1S钎料在Cu基板上的润湿铺展面积的影响
图7  SnZn-0.1S-xP钎料在HCl溶液中的腐蚀失重曲线
图8  SnZn-0.1S-xP钎料在pH3.7的HCl溶液中浸泡后的表面形貌
图9  SnZn-0.1S-xP钎料在pH3.7的HCl溶液中浸泡后腐蚀产物的XRD图谱
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