|
|
P对Sn-9Zn-0.1S无铅钎料性能的影响 |
李玲妹1, 黄惠珍1(), 张青环1, 帅歌旺2 |
1.南昌大学材料科学与工程学院 南昌 330031 2.南昌航空大学航空制造工程学院 南昌 330063 |
|
Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder |
LI Lingmei1, HUANG Huizhen1(), ZHANG Qinghuan1, SHUAI Gewang2 |
1.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China 2.School of Aeronautical Manufacturing Engineering, Nanchang HangKong University, Nanchang 330063, China |
引用本文:
李玲妹, 黄惠珍, 张青环, 帅歌旺. P对Sn-9Zn-0.1S无铅钎料性能的影响[J]. 材料研究学报, 2021, 35(8): 615-622.
Lingmei LI,
Huizhen HUANG,
Qinghuan ZHANG,
Gewang SHUAI.
Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder[J]. Chinese Journal of Materials Research, 2021, 35(8): 615-622.
1 |
Liu S, Xue S B, Xue P, et al. Present status of Sn-Zn lead-free solders bearing alloying elements [J]. J. Mater. Sci.: Mater. Electron., 2015, 26: 4389
|
2 |
Zhang X P, Yin L M, Yu C B. Advances in research and application of lead-free solders for electronic and photonic packaging [J]. Chin. J. Mater. Res., 2008, 22: 1
|
2 |
张新平, 尹立孟, 于传宝. 电子和光子封装无铅钎料的研究和应用进展 [J]. 材料研究学报, 2008, 22: 1
|
3 |
Wei X Q, Zhou L, Huang H Z. Effects of oxidation on wettability of Sn-Zn alloys [J]. Chin. J. Nonferrous Met., 2009, 19: 174
|
3 |
魏秀琴, 周浪, 黄惠珍. 氧化对Sn-Zn系无铅焊料润湿性的影响 [J]. 中国有色金属学报, 2009, 19: 174
|
4 |
Zhang L, Yang F, Zhong S J. ZnO whiskers growth on the surface of Sn9Zn/Cu solder joints in concentrator silicon solar cells solder layer [J]. High Technol. Lett., 2017, 23: 337
|
5 |
Mohamed M N, Aziz N A, Mohamad A A, et al. Polarization study of Sn-9Zn and Sn-37Pb solders in hydrochloric acid solution [J]. Int. J. Electroactive Mater., 2015, 3: 28
|
6 |
Fazal M A, Liyana N K, Rubaiee S, et al. A critical review on performance, microstructure and corrosion resistance of Pb-free solders [J]. Measurement, 2019, 134: 897
|
7 |
Chen W X. Effects of Ag, Ga, Al and Ce on the properties of Sn-9Zn lead-free solder [D]. Nanjing: Nanjing University of Aeronautics and Astronautics, 2013
|
7 |
陈文学. Ag、Ga、Al及Ce对Sn-9Zn无铅钎料性能的影响 [D]. 南京: 南京航空航天大学, 2013
|
8 |
Al-Ezzi A, Al-Bawee A, Dawood F, et al. Effect of bismuth addition on physical properties of Sn-Zn lead-free solder alloy [J]. J. Electron. Mater., 2019, 48: 8089
|
9 |
Zhang L, Yang F, Guo Y H, et al. Effect of rare earth Yb on the properties of Sn-Zn lead-free solders [J]. Chin. Rare Earths, 2017, 38(5): 33
|
9 |
张亮, 杨帆, 郭永环等. 含Yb的Sn-Zn无铅钎料性能研究 [J]. 稀土, 2017, 38(5): 33
|
10 |
Jing Y X. Investigation of Sn-Zn solder alloys and the bonding mechanism of solder/Cu substrate [D]. Chongqing: Chongqing University, 2013
|
10 |
景彦霞. Sn-Zn合金钎料及其与Cu基板界面结合机理研究 [D]. 重庆: 重庆大学, 2013
|
11 |
Xie J Y, Wang Z H, Chen Y M, et al. Effect of trace Ti on corrosion resistance of lead-free Sn-9Zn-xTi solder [J]. Electron. Comp. Mater., 2017, 36(8): 103
|
11 |
谢景洋, 王正宏, 陈一鸣等. 微量Ti对Sn-9Zn-xTi无铅焊料耐蚀性的影响 [J]. 电子元件与材料, 2017, 36(8): 103
|
12 |
Pietrzak K, Grobelny M, Makowska K, et al. Structural aspects of the behavior of lead-free solder in the corrosive solution [J]. J. Mater. Eng. Perform., 2012, 21: 648
|
13 |
Han R N. Development of special flux matching Sn-Zn lead-free solder for electronic packaging [D]. Nanjing: Nanjing University of Aeronautics and Astronautics, 2013
|
13 |
韩若男. 电子封装用Sn-Zn无铅钎料专用助焊剂研究 [D]. 南京: 南京航空航天大学, 2013
|
14 |
Cheng L. Modification resistance of sulfur adding on tin-based lead-free solder [D]. Nanchang: Nanchang University, 2015
|
14 |
程龙. 硫合金化对锡基无铅焊料的改性作用研究 [D]. 南昌: 南昌大学, 2015
|
15 |
Wei X Q, Li Y H, Huang H Z. Effects of sulfur on the properties of Sn-9Zn as lead-free solder [J]. J. Electron. Mater., 2017, 46: 1067
|
16 |
Huang H Z, Lu D, Shuai G W, et al. Effects of phosphorus addition on the corrosion resistance of Sn-0.7Cu lead-free solder alloy [J]. Trans. Indian Inst. Met., 2016, 69: 1537
|
17 |
Yan J K, Chen D D, Gan Y W, et al. Effect of P on properties of Sn-0.7Cu lead-free solder alloy [J]. Mater. Sci. Technol., 2019, 27(5): 39
|
17 |
严继康, 陈东东, 甘有为等. P元素对Sn-0.7Cu焊料合金性能的影响 [J]. 材料科学与工艺, 2019, 27(5): 39
|
18 |
Li H, Lu B, Zhu H W. Effect of P on oxidation resistance of low-silver lead-free solder [J]. Hot Work. Technol., 2012, 41(7): 143
|
18 |
粟慧, 卢斌, 朱华伟. 微量磷元素对低银系无铅钎料抗氧化性能的影响 [J]. 金属铸锻焊技术, 2012, 41(7): 143
|
19 |
Massalski T B. Binary Alloy Phase Diagrams [M]. Ohio: ASM International, 1990
|
20 |
Wang Q M. Influence of trace elements on the wettability and oxidation of liquid Sn-0.7Cu lead-free solder [D]. Chongqing: Chong-qing University, 2015
|
20 |
王青萌. 微量元素对Sn-0.7Cu无铅钎料润湿性和高温抗氧化性的影响 [D]. 重庆: 重庆理工大学, 2015
|
21 |
Key Chung C, Chen Y J, Li C C, et al. The critical oxide thickness for Pb-free reflow soldering on Cu substrate [J]. Thin Solid Films, 2012, 520: 5346
|
22 |
Pstruś J, Gancarz T, Fima P. Effect of indium additions on the formation of interfacial intermetallic phases and the wettability at Sn-Zn-In/Cu interfaces [J]. Adv. Mater. Sci. Eng., 2017, 2017: 9756769
|
23 |
Wang Z H, Chen C T, Jiu J T, et al. Electrochemical behavior of Sn-9Zn-xTi lead-free solders in neutral 0.5M NaCl solution [J]. J. Mater. Eng. Perform., 2018, 27: 2182
|
24 |
Mostofizadeh M, Frisk L. Corrosion behavior of Sn-Zn-Bi and Sn-Pb-Ag solders in a salt spray test [A]. Proceedings of the 5th Electronics System-Integration Technology Conference [C]. Helsinki, Finland: IEEE, 2014: 1
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|