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材料研究学报  2014, Vol. 28 Issue (7): 528-534    DOI: 10.11901/1005.3093.2013.877
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热处理对冷轧铜铝复合板材界面扩散层结构的影响*
左晓姣,袁晓光(),黄宏军,刘欢
沈阳工业大学材料科学与工程学院 沈阳 110780
Effect of Heat Treatment on Microstructure of Interfacial Diffusion Layer of Cu/Al Composite Laminate Prepared by Cold Rolling
Xiaojiao ZUO,Xiaoguang YUAN(),Hongjun HUANG,Huan LIU
School of Materials Science and Engineering, Shenyang University of Technology, Shenyang, 110780
引用本文:

左晓姣,袁晓光,黄宏军,刘欢. 热处理对冷轧铜铝复合板材界面扩散层结构的影响*[J]. 材料研究学报, 2014, 28(7): 528-534.
Xiaojiao ZUO, Xiaoguang YUAN, Hongjun HUANG, Huan LIU. Effect of Heat Treatment on Microstructure of Interfacial Diffusion Layer of Cu/Al Composite Laminate Prepared by Cold Rolling[J]. Chinese Journal of Materials Research, 2014, 28(7): 528-534.

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摘要: 

用SEM、TEM、微区XRD等手段分析了复合板界面扩散层的形貌和结构, 研究了热处理工艺对冷轧铜铝复合板材界面扩散层结构的影响, 讨论界面扩散层形成规律。研究表明, 冷轧铜铝复合板经过扩散热处理后, 在复合界面形成具有扩散性质的界面层, 随着热处理时间的延续, 界面扩散层由最初的单层逐渐生长为三层, 进一步延长热处理时间, 界面层的层数不变, 厚度略有增加; 界面层含有q(Al2Cu)相、h2(AlCu)相和g2(Al4Cu9)相等金属间化合物; 界面扩散层结构为: 铝侧的Al-Cu固溶体与q(Al2Cu)相复合层、h2(AlCu)相层和铜侧的Cu-Al固溶体与g2(Al4Cu9)相复合层。

关键词 金属材料铜铝复合板热处理扩散层金属间化合物    
Abstract

The effect of heat treatment on the microstructure of the interfacial diffusion layer of Cu/Al composite laminate prepared by cold rolling was investigated by means of SEM, TEM and micro-XRD The results show that an interfacial diffusion layer may form soon after heat treatment at high temperature; then as the heating time lengthened, the interfacial diffusion layer growths gradually from the original single-layer to become a three-layed one, while the heating time further lengthened, the morphology of the interfacial diffusion layer kept more or less unchanged besides a slight thickening; the interfacial diffusion layer consists of a layer of Al-Cu solid solution with intermetallic compound q(Al2Cu) nearby the Al side, a layer of h2(AlCu) in the middle and a layer of Cu-Al solid solution with intermetallic compound g2(Al4Cu9) nearby the Cu side.

Key wordsmetallic materials    Cu/Al composite laminate    heat treatment    diffusion layer    intermetallic compound
收稿日期: 2013-11-20     
基金资助:* 国家自然科学基金51074108 资助项目。
图1  轧制态铜铝复合界面形貌
图2  300℃扩散热处理不同扩散时间下铜铝复合板结合界面形貌
图3  300℃-10 min热处理后铜铝复合界面形态
图4  300℃-10 h热处理后界面扩散层铝侧和铜侧微观组织形貌
图5  300℃-10 h热处理后界面处铝和Cu元素的线分布
图6  
图7  300℃-10 h热处理后铜铝复合板界面扩散层微观组织
图8  300℃-10 h热处理后铜/铝复合界面微区X衍射选区及低角度和高角度原位二维衍射图
图9  300℃-10 h热处理后微区X衍射分析图谱
图10  300℃-10 h热处理后铜/铝复合界面区铝侧和铜侧电子衍射分析
图11  铜铝冷轧复合板经过热处理后形成的界面扩散层的结构
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