Ti种子层对Cu薄膜的微观织构和表面形貌的影响<sup>*</sup>

doi:10.11901/1005.3093.2014.654

材料研究学报

2015, Vol. 29

Issue (6): 417-421 DOI: 10.11901/1005.3093.2014.654

本期目录 | 过刊浏览

Ti种子层对Cu薄膜的微观织构和表面形貌的影响^*

李玮,陈冷(

)

北京科技大学材料科学与工程材料学院北京100083

Effect of Ti Seed Layer on the Texture and Surface Morphology of Cu Thin Films

Wei LI,Leng CHEN(

)

School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China

引用本文:

李玮,陈冷. Ti种子层对Cu薄膜的微观织构和表面形貌的影响^*[J]. 材料研究学报, 2015, 29(6): 417-421.
Wei LI, Leng CHEN. Effect of Ti Seed Layer on the Texture and Surface Morphology of Cu Thin Films[J]. Chinese Journal of Materials Research, 2015, 29(6): 417-421.

全文: PDF(2277 KB) HTML

摘要:

用磁控溅射法制备无种子层的Cu薄膜和加入Ti作为种子层的Ti/Cu薄膜, 用电子背散射衍射技术(EBSD)研究了无种子层的Cu薄膜及有Ti种子层的Ti/Cu薄膜的微观织构, 并用原子力显微镜(AFM)观察了两种薄膜的表面形貌。结果表明, 加入Ti作为种子层增强了Cu薄膜的{111}纤维织构, 对薄膜生长有很好的外延作用。同时, 加入Ti种子层可降低退火处理后薄膜内退火孪晶的产生几率, 但是在退火过程中使孔洞出现。

关键词 ：金属材料, Cu薄膜, Ti种子层, 织构, 表面形貌

Abstract：

ABSTARCT Cu thin films were deposited by magnetron sputtering on SiO₂ substrate pre-coated without and with a thin Ti seed layer. Then the surface morphology and micro-texture of the films were characterized by means of electron back-scattered diffraction (EBSD) and atomic force microscope (AFM). The results show that the Cu thin film deposited on the Ti seed layer showed a highly oriented {111} fiber texture. Meanwhile, the generation probability of twins of the Cu thin films induced by annealing treatment could be decreased due to the existence of the Ti seed layer, but voids could occur on the Cu thin film.

Key words： metallic materials Cu thin film Ti seed layer texture surface morphology

收稿日期: 2014-11-07

基金资助:^*国家自然科学基金51171018资助项目。

作者简介: 陈冷, 教授

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https://www.cjmr.org/CN/10.11901/1005.3093.2014.654 或 https://www.cjmr.org/CN/Y2015/V29/I6/417

图1 20 nm Ti种子层极图

图2 Cu薄膜取向成像图

图3 无种子层和加入Ti种子层的Cu薄膜反极图

表1 Cu、Ti与Si的晶面错配度

图4 晶粒取向差分布图

图5 无种子层和加入Ti种子层的薄膜三维表面形貌图

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