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材料研究学报  2026, Vol. 40 Issue (6): 450-456    DOI: 10.11901/1005.3093.2025.300
  研究论文 本期目录 | 过刊浏览 |
还原氧化石墨烯铜基复合材料的耐腐蚀性能及其机理
姜兴国1, 沈文卓2,3(), 杨涛2, 张佳利2,3, 钟民2,3, 曹贺4, 郭守武2()
1.上海交通大学自动化与感知学院 上海 200240
2.上海交通大学集成电路学院 上海 200240
3.上海交通大学 微纳科学技术国家重点实验室 上海 200240
4.上海交通大学材料科学与工程学院 上海 200240
Enhancing Effect and Mechanism of Reduced Graphene Oxide on the Corrosion Resistance of Copper-based Composites
JIANG Xingguo1, SHEN Wenzhuo2,3(), YANG Tao2, ZHANG Jiali2,3, ZHONG Min2,3, CAO He4, GUO Shouwu2()
1.School of Automation and Intelligent Sensing, Shanghai Jiao Tong University, Shanghai 200240, China
2.School of Integrated Circuits, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
3.State Key Laboratory of Micro-Nano Engineering Science, Shanghai Jiao Tong University, Shanghai 200240, China
4.School of Materials and Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
引用本文:

姜兴国, 沈文卓, 杨涛, 张佳利, 钟民, 曹贺, 郭守武. 还原氧化石墨烯铜基复合材料的耐腐蚀性能及其机理[J]. 材料研究学报, 2026, 40(6): 450-456.
Xingguo JIANG, Wenzhuo SHEN, Tao YANG, Jiali ZHANG, Min ZHONG, He CAO, Shouwu GUO. Enhancing Effect and Mechanism of Reduced Graphene Oxide on the Corrosion Resistance of Copper-based Composites[J]. Chinese Journal of Materials Research, 2026, 40(6): 450-456.

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摘要: 

制备铜和铜/还原氧化石墨烯(Cu/rGO)复合材料并进行电化学和力学性能测试、电化学阻抗谱分析、微观结构表征,比较了Cu/rGO复合材料与铜在3.5% (质量分数)氯化钠(NaCl)水溶液和盐雾环境中的腐蚀,研究了rGO使铜基复合材料耐腐蚀性能提高及其机理。结果表明,在盐雾环境中Cu/rGO的腐蚀速率仅为0.625 × 10-5 g·cm-2·h-1,比纯铜(1.875 × 10-5 g·cm-2·h-1)降低66.67%。Cu/rGO表面的腐蚀坑较少、尺寸较小,在腐蚀环境中屈服强度的降低(3 MPa)显著低于纯铜(18 MPa)。在NaCl水溶液中Cu/rGO复合材料的腐蚀速率比纯铜降低了34.8%。Cu/rGO复合材料耐蚀性能的提高可归因于rGO片层在铜基体中形成了物理阻隔结构,这种结构延缓了氯离子的渗透和电荷转移。Cu/rGO具有较高的电荷转移电阻和表面膜电阻,使界面反应更难进行和腐蚀产物膜更为致密。

关键词 材料失效与保护铜基石墨烯复合材料抗腐蚀性能电化学腐蚀盐雾腐蚀腐蚀环境下力学性能    
Abstract

Cu is widely used due to its excellent electrical and thermal conductivity properties. However, its corrosion resistance in chlorine-containing environments (such as seawater or salt fog) is poor, which limits its long-term application in harsh conditions. To address this challenge, herein block composite of Cu/reduced graphene oxide (Cu/rGO) was fabricated via processes as follows: billets of which were prepared by vacuum hot pressing with mixture of Cu powder and rGO as raw material, and then they were successively subjected to hot-forging and -rolling. Further, the corrosion behavior of Cu/rGO composite and pure Cu in 3.5%NaCl aqueous solution and salt fog was comparatively assessed. Results show that the corrosion rate of Cu/rGO composite in NaCl aqueous solution was 34.8% lower than that of pure Cu, this may be mainly attributed to the physical barrier effect of the lamellar rGO, which effectively delayed the penetration of chloride ions and the charge transfer process. The Cu/rGO had a higher charge transfer resistance and higher electrochemical impedance, indicating that the interface reaction was more difficult to occur and the corrosion product film was compact. In the salt spray testing conditions, the corrosion rate of Cu/rGO was only 0.625 × 10-5 g·cm-2·h-1, which was 66.67% lower than that of pure Cu (1.875 × 10-5 g·cm-2·h-1). The number and size of corrosion pits on the surface of Cu/rGO were small and few, and the decrease in yield strength after corrosion (3 MPa) was significantly lower than that of pure Cu (18 MPa). The findings revealed the mechanism of rGO in enhancing the corrosion resistance of copper-based composites from multiple perspectives, including electrochemical behavior, microscopic morphology, and mechanical properties. Which may provide meaningful reference for the application of composite of Cu/rGO in marine engineering and high-humidity, high-salt environments.

Key wordsmaterial failure and protection    copper-based graphene composite    material corrosion resistance    electrochemical corrosion    salt-spray corrosion    mechanical properties under corrosive conditions
收稿日期: 2025-10-10     
ZTFLH:  TG172  
通讯作者: 沈文卓,讲师,shenwenzhuo@sjtu.edu.cn,研究方向为纳米复合材料;
郭守武,教授,swguo@sjtu.edu.cn,研究方向为纳米复合材料
Corresponding author: SHEN Wenzhuo, E-mail: shenwenzhuo@sjtu.edu.cn;
GUO Shouwu, E-mail: swguo@sjtu.edu.cn
作者简介: 姜兴国,男,1998年生,硕士生
图1  Cu颗粒和Cu/rGO颗粒的SEM照片以及Cu/rGO块体在FeCl3/HCl溶液中蚀刻30 min后断裂区域的SEM照片
图2  Cu和Cu/rGO块体电化学蚀刻不同时间得到的Nyquist图、等效电路图、在3.5%的NaCl水溶液中蚀刻3 d后Cu和Cu/rGO块体表面的SEM照片
SampleRs / Ω·cm2Qct / μF·cm-2nctRct / Ω·cm2Qf / μF·cm-2nfRf / Ω·cm2Error / %
Cu 1 h11.0624.460.910.001025830.70.30617.866 × 10102.53
Cu 12 h8.3665.910.78498.3455.10.30681.101 × 10112.04
Cu 24 h13.6492.650.751048558.40.35598.807 × 10101.88
Cu 3 d8.57103.40.775307890.70.62291.054 × 1042.92
Cu 7 d10.58116.40.781056015100.56596.734 × 1095.66
Cu/rGO bulk-1 h7.7927.070.897.5767.40.35348.669 × 10111.62
Cu/rGO bulk-12 h7.5686.340.77566.4450.20.30532.129 × 10111.67
Cu/rGO bulk-24 h8.11102.10.771433477.90.32924.013 × 10111.87
Cu/rGO bulk-3 d9.87111.90.786003821.30.54091.089 × 1042.56
Cu/rGO bulk-7 d9.47188.30.79152223900.27571.210 × 10103.52
表1  在电化学腐蚀环境Cu和Cu/rGO块体的EIS结果
图3  Cu和Cu/rGO块体的Tafel曲线以及Cu/rGO块体在3.5%NaCl水溶液中电蚀刻3 d的示意图
SampleIcorr / μA·cm-2Ecorr / mVCR / cm·a-1IE / %
Cu-1 h123.4-2952.90-
Cu-12 h55.89-2691.31-
Cu-24 h32.37-2680.76-
Cu-3 d23.31-2700.55-
Cu-7 d5.962-3070.14-
Cu/rGO bulk-1 h80.43-2911.8934.8
Cu/rGO bulk-12 h38.15-2700.9031.7
Cu/rGO bulk-24 h25.13-2720.5922.4
Cu/rGO bulk-3 d17.92-2730.4423.1
Cu/rGO bulk-7 d4.852-3040.1118.6
表2  电化学测量的腐蚀参数
图4  在不同盐溶液中蚀刻前后Cu和Cu/rGO块体的拉伸应力-应变曲线、在不同盐溶液条件下蚀刻前后Cu和Cu/rGO块体的机械性能柱状图以及在3.5%的NaCl盐雾中Cu及Cu/rGO块体的光学显微镜照片
Samplem1 / gm2 / gRsp / g·cm-2·h-1
Cu0.26790.26701.875 × 10-5
Cu/rGO bulk0.31040.31010.625 × 10-5
表3  盐雾处理前后Cu和Cu/rGO/氧化石墨烯块体的质量和电阻率
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