超高压熔渗法制备铜/金刚石复合材料的热导率*

doi:10.11901/1005.3093.2013.880

材料研究学报

2014, Vol. 28

Issue (5): 321-324 DOI: 10.11901/1005.3093.2013.880

本期目录 | 过刊浏览

超高压熔渗法制备铜/金刚石复合材料的热导率*

何金珊,张海龙,张洋,李建伟,王西涛(

)

北京科技大学新金属材料国家重点实验室北京 100083

Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method

Jinshan HE,Hailong ZHANG,Yang ZHANG,Jianwei LI,Xitao WANG(

)

State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083

引用本文:

何金珊,张海龙,张洋,李建伟,王西涛. 超高压熔渗法制备铜/金刚石复合材料的热导率*[J]. 材料研究学报, 2014, 28(5): 321-324.
Jinshan HE, Hailong ZHANG, Yang ZHANG, Jianwei LI, Xitao WANG. Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method[J]. Chinese Journal of Materials Research, 2014, 28(5): 321-324.

全文: PDF(2388 KB) HTML

摘要:

用超高压熔渗法制备了金刚石体积分数为90%的铜/金刚石复合材料, 其热导率为662 Wm^-1K^-1, 比用其它方法制备的这种材料的热导率高。SEM、EDS和XRD的表征结果表明, 这种铜/金刚石复合材料的界面结合良好, 金刚石与铜之间有过渡层, 部分金刚石相互连通。

关键词 ：复合材料, 热导率, 超高压熔渗法, 铜/金刚石

Abstract：

The Cu/diamond composites containing 90% (volume fraction) diamond particles were prepared at 1200°C under a pressure of 5 GPa by high pressure liquid infiltration method, giving a measured thermal conductivity of 662 Wm^-1K^-1. The characterization of composites by means of SEM, EDS and XRD shows that the interfacial bonding of Cu/diamond is strong, and a transition layer exists between diamond and Cu. Besides, some diamond particles are found to be inter-connected. The Cu/diamond composites fabricated by this method exhibited a thermal conductivity far superior to those produced by other means.

Key words： composites thermal conductivity high pressure liquid infiltration Cu/diamond

收稿日期: 2013-11-20

基金资助:* 国家自然科学基金51271017和中央高校基本科研业务费FRF-TP-13-033A资助项目。

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https://www.cjmr.org/CN/10.11901/1005.3093.2013.880 或 https://www.cjmr.org/CN/Y2014/V28/I5/321

图1 铜/金刚石复合材料的制备工艺曲线

图2 铜/金刚石复合材料的XRD图谱

图3 铜/金刚石复合材料的表面微观结构

图4 铜/金刚石复合材料的断口SEM像

图5 铜/金刚石复合材料的界面线扫描结果

图6 不同方法制备的铜/金刚石复合材料热导率比较

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