|
|
制备方法对W--10\%Ti合金组织性能的影响 |
王庆相; 范志康; 杨怡 |
西安理工大学材料科学与工程学院 西安 710048 |
|
Effect of preparation methods on microstructure and properties of W--10%Ti alloy |
WANG Qingxiang; FAN Zhikang; YANG Yi |
School of Materials Science and Engineering; Xi'an University of Technology; Xi'an 710048 |
引用本文:
王庆相 范志康 杨怡 . 制备方法对W--10\%Ti合金组织性能的影响[J]. 材料研究学报, 2009, 23(3): 293-299.
,
.
Effect of preparation methods on microstructure and properties of W--10%Ti alloy[J]. Chin J Mater Res, 2009, 23(3): 293-299.
1 R.J.Gutmann, T.P.Chow, A.E.Kaloyeros, Thermal stability of on–chip copper interconnect structures, Thin Solid Films, 262(1–3), 177(1995)
2 G.Raghavan, C.Chiang, P.B.Anders, Diffusion of copper through dielectric films under bias temperature stress, Thin Solid Films, 262(1–2), 168(1995)
3 A.G.Dirks, R.A.M.Wolters, A.J.M.Nellissen, On the microstructure property relationship of W–Ti–(N) diffusion barriers, Thin Solid Films, 193–194, 201(1990)
4 H.Ramarotafika, G.Lemperiere, Influence of a d.c. substrate bias on the resistivity, composition, crystallite size and microstrain of W–Ti and W–Ti–N films, Thin Solid Films, 266(2), 267(1995)
5 WANG Zanhai, WANG Xingming, CHU Maoyou, Preparation of W–Ti sputtering targets under inert atmosphere, Chinese Journal of Rare Metals, 30(5), 688(2006)
(王赞海, 王星明, 储茂友, 惰性气体热压法制备W/Ti合金靶材研究, 稀有金属, 30(5), 688(2006))
6 C.E.Wickersham, Jr., J.E.Poole, J.J.Mueller, Particle contamination during sputter deposition of W–Ti films, J. Vac. Sci. Technol. A, 10, 1713(1992)
7 Chifung Lo, Paul Gilman, Particle generation in W–Ti deposition, J. Vac. Sci. Technol. A, 17(2), 608(1999)
8 Alireza Nouri, CHEN Xiaobo, YUN Cang, Synthesis of Ti–Sn–Nb alloy by powder metallurgy, Mater. Sci. Eng., A, 485, 562(2008)
9 C.E.Wickersham, Method of producing tungsten–titanium sputter targets and targets produced thereby, United States Patent, 5234487(1993)
10 J.Laszo. Kecskes, Ian W. Hall, Microstructural effects in hot–explosively–consolidated W–Ti alloy, Journal of Materials Processing Technology, 94, 247(1999)
11 A.J.Dunlop, C.E.Waterman, T.Brat, Effects of titanium– tungsten target processing methods on defect generation during very large scale integrated device fabrication, Vac. Sci. Tech. A, 10(2), 305(1992)
12 PAN Jinsheng, TONG Jianmin, TIAN Minbo, Materials Science Foundation (Beijing, Tsinghua University Press, 1998) p.450
(潘金生, 仝健民, 田民波, 材料科学基础 (北京, 清华大学出版社, 1998) p.450)
13 XIE Chengmu, Titanium and Titanium Alloy Casting (Beijing, China Machine Press, 2005) p.14
(谢成木, 钛及钛合金铸造 (北京, 机械工业出版社, 2005) p.14)
14 A.J.Dunlop, Hans Rensing, Method for making tungsten– titanium sputtering targets and product, United States Patent, 4838935 (1989) |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|