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| 电子和光子封装无铅钎料的研究和应用进展 |
| 张新平; 尹立孟; 于传宝 |
| 华南理工大学机械工程学院材料科学与技术研究所; 华南理工大学机械工程学院材料科学与技术研究所 广州; |
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引用本文:
张新平; 尹立孟; 于传宝. 电子和光子封装无铅钎料的研究和应用进展[J]. 材料研究学报, 2008, 22(1): 1-9.
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