<strong>GNP-Ni/Cu</strong>复合材料的界面调控和强化机理

doi:10.11901/1005.3093.2021.492

材料研究学报

2022, Vol. 36

Issue (10): 777-785 DOI: 10.11901/1005.3093.2021.492

研究论文

本期目录 | 过刊浏览

GNP-Ni/Cu复合材料的界面调控和强化机理

宗意勋, 李树丰(

), 刘磊, 张鑫, 潘登, 吴代惠玉

西安理工大学材料科学与工程学院西安 710048

Interface Regulation and Strengthening Mechanism of GNP-Ni/Cu Composites

ZONG Yixun, LI Shufeng(

), LIU Lei, ZHANG Xin, PAN Deng, WU Daihuiyu

School of Materials Science and Engineering, Xi´an University of Technology, Xi´an 710048, China

引用本文:

宗意勋, 李树丰, 刘磊, 张鑫, 潘登, 吴代惠玉. GNP-Ni/Cu复合材料的界面调控和强化机理[J]. 材料研究学报, 2022, 36(10): 777-785.
Yixun ZONG, Shufeng LI, Lei LIU, Xin ZHANG, Deng PAN, Daihuiyu WU. Interface Regulation and Strengthening Mechanism of GNP-Ni/Cu Composites[J]. Chinese Journal of Materials Research, 2022, 36(10): 777-785.

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摘要:

采用粉末冶金法,通过“湿法混合”、放电等离子烧结和热挤压相结合的三步工艺分别制备了石墨烯纳米片(GNP)增强铜基复合材料(GNP-Cu)和GNP-Ni增强铜基复合材料(GNP-Ni/Cu)。通过物相组成和显微组织表征,并结合致密度、电导率和力学性能测试,结果表明：GNP和Ni的含量(质量分数)分别为0.2%和1.5%的GNP-Ni/Cu复合材料,其显微硬度和屈服强度比纯Cu分别提高了38%和50%、比0.2GNP/Cu复合材料分别提高了14.0%和11.6%。这些结果表明,Ni的添加改善了GNP与Cu的界面结合,使GNP-Ni/Cu复合材料的力学性能显著提高。GNP的载荷传递强化和热失配强化以及Ni的固溶强化,是材料力学性能提高的主要原因。

关键词 ：复合材料, 粉末冶金法, 力学性能, 界面调控, 强化机理

Abstract：

Graphene nanosheets (GNP) reinforced Cu-based composites GNP-Cu and GNP-Ni/Cu were prepared via a three-step process, i.e. wet mixing powders of Cu, Ni and GNP, then spark plasma sintering and finally hot extrusion. The phase composition, microstructure, density, electrical conductivity, and mechanical properties of GNP-Ni/Cu composites were characterized, and the mechanism of GNP and Ni strengthening GNP-Ni /Cu composites was also investigated. The results show that the microhardness and yield strength of GNP-Ni/Cu composite with 0.2% GNP and 1.5% Ni (in mass fraction) are 38% and 50% higher than those of simple Cu, and 14.0% and 11.6% higher than those of 0.2GNP/Cu composite, respectively. These results indicate that the interface bonding between GNP and Cu was improved by Ni addition, and the mechanical properties of GNP-Ni/Cu composites were significantly improved. The load transfer strengthening and thermal mismatch strengthening of GNP and the Ni solution strengthening are the main causes for the improvement of mechanical properties of materials.

Key words： composites powder metallurgy mechanical properties interface control strengthening mechanism

收稿日期: 2021-08-24

ZTFLH:

TF124

基金资助:国家自然科学基金(51871180)

作者简介: 宗意勋,男,1995年生,硕士生

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https://www.cjmr.org/CN/10.11901/1005.3093.2021.492 或 https://www.cjmr.org/CN/Y2022/V36/I10/777

图1 铜基复合材料制备方法示意图

图2 原始粉末的显微组织

图3 原始GNP、0.2GNP/Cu和0.2GNP-1.5Ni/Cu混合粉末以及挤压态复合材料的拉曼光谱

图4 GNP/Cu和GNP-Ni/Cu混合粉末以及挤压态复合材料的XRD图谱

图5 0.2GNP/Cu和0.2GNP-1.5Ni/Cu复合材料的显微组织

图6 挤压态0.2GNP-1.5Ni/Cu复合材料的TEM照片和对应的选区电子衍射花样和晶格衍射条纹

图7 挤压态纯Cu和CMCs的EBSD结果

图8 纯Cu和CMCs的致密度和电导率

图9 挤压态纯Cu和CMCs的应力-应变曲线

图10 纯Cu和CMCs的断口形貌

图11 各强化机制对GNP-Ni/Cu复合材料屈服强度的理论贡献

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