Effect of PEG6000 on Electroless Copper in Dual-Ligands System

doi:10.11901/1005.3093.2019.060

Chinese Journal of Materials Research

2019, Vol. 33

Issue (9): 666-672 DOI: 10.11901/1005.3093.2019.060

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Effect of PEG6000 on Electroless Copper in Dual-Ligands System

LU Jianhong^1,²,DENG Xiaomei³,YAN Jianhui³,TU Jiguo¹,WANG Mingyong¹(

),JIAO Shuqiang¹(

)

1. State Key Laboratory of Advanced Metallurgy, University of Science and Technology Beijing, Beijing 100083, China
2. Changzhou Institutes of Advanced Materials, Beijing University of Chemical Technology, Changzhou 213164, China
3. School of Chemistry and Chemical Engineering, Hunan Institute of Science and Technology, Yueyang 414006, China

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LU Jianhong, DENG Xiaomei, YAN Jianhui, TU Jiguo, WANG Mingyong, JIAO Shuqiang. Effect of PEG6000 on Electroless Copper in Dual-Ligands System. Chinese Journal of Materials Research, 2019, 33(9): 666-672.

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Abstract

The effect of surfactant polyethylene glycol (PEG) 6000 on the electroless copper plating process in a bath of dual-ligands ethylenediamine tetraacetic acid (EDTA)/tetrahydroxypropyl ethylenediamine (THPED) was investigated by electrochemical method. Mixed potential-time curves indicate that the overall process can be divided into three districts: induction, transitional and stable region. PEG6000 can slowdown the negative shifting of electrode potential, which related to the retardation of the adsorption of charged ions resulted from the surfactant adsorption on the copper electrode. Linear sweep voltammetry measurements show that cathodic reduction reaction is the controlling step for the plating process; PEG6000 could retard cathodic polarization, therewith, the peak value of cathodic reduction current decreased about 40%, so PEG6000 linearly reduced deposit speed. The copper layers prepared from the bath with PEG6000 are product of high-purity with a surface morphology of uniformly distributed fine particles, moreover, the addition of PEG6000 favored the formation of copper layer with (220) preferred orientation with refined grains of average size 50.0 nm, in comparison with 77.7 nm that from the bath without PEG6000 addition.

Key words: surface and interface in the materials electroless copper surfactant polyethylene glycol 6000 mixed potential preferred orientation

Received: 14 January 2019

ZTFLH:

TQ153

Fund: the Changzhou Science and Technology Program(CJ20180014)

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	LU Jianhong
	DENG Xiaomei
	YAN Jianhui
	TU Jiguo
	WANG Mingyong
	JIAO Shuqiang

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https://www.cjmr.org/EN/10.11901/1005.3093.2019.060 OR https://www.cjmr.org/EN/Y2019/V33/I9/666

Table1 Chemical composition under PEG6000 concertration

Fig.1 E _mix-t curves under different PEG6000 concentration

Table 2 Fall-off value of E _mix under different PEG6000 concentration

Fig.2 Influence of PEG6000 concentration on the cathodic reduction of Cu(II)ion

Table 3 Current value of cathodic reduction for different PEG6000 concentration

Fig.3 Influence of PEG6000 concentration on the anodic oxidation of formaldehyde

Table 4 Current value of anodic oxidation for different PEG6000 concentration

Fig.4 Effect of PEG6000 concentration on the copper deposition rate

Fig.5 SEM micrographs at different PEG6000 concentration (a) 20 mg, (b) 25 mg, (c) 30 mg, (d) 35 mg, (e) 40 mg

Fig.6 EDS micrographs at different PEG6000 concentration (a) 20 mg, (b) 25 mg, (c) 30 mg, (d) 35 mg, (e) 40 mg

Fig.7 XRD patterns of electroless copper layer at different PEG6000

Table 5 Intensity ratio of the XRD patterns at different PEG6000 concentration

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