Studies on Microstructure Evolution of Inverted Pyramid–shaped Arrays Prepared by Wet Etching in TMAH Solution Containing IPA

Chin J Mater Res

2011, Vol. 25

Issue (5): 495-499 DOI:

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Studies on Microstructure Evolution of Inverted Pyramid–shaped Arrays Prepared by Wet Etching in TMAH Solution Containing IPA

XIAO Ting¹, LIU Bo¹, WANG Xinlian², WANG Chunfen³, REN Ding¹

1.Key Laboratory of Radiation and Technology of Education Ministry of China, Institute of Nuclear Science and Technology, Sichuan University, Chengdu 610064
2.Department of Math and Physics, Henan University of Urban Construction, Pingdingshan 467001
3.Institute of Luoyang Ship Materials, China Shipbuilding Heavy Industry, Luoyang 471039

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XIAO Ting LIU Bo WANG Xinlian WANG Chunfen REN Ding. Studies on Microstructure Evolution of Inverted Pyramid–shaped Arrays Prepared by Wet Etching in TMAH Solution Containing IPA. Chin J Mater Res, 2011, 25(5): 495-499.

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Abstract The inverted pyramid-shaped arrays with smooth surface are studied using anisotropic wet etching in TMAH solution containing IPA, which were prepared on (100) orientation silicon wafers with the arrays of 10 μm×10 μm windows. Etching rates and anisotropic factor of the monocrystalline silicon are reduced by adding IPA to TMAH solution in comparison with pure TMAH. It is generally thought that the side facets of inverted pyramid–shaped structures are bounded by (111) planes, but this research indicates that inverted pyramid-shaped structures undergo dramatic changes in shape. At the beginning of etching, the side facets of the inverted pyramid-shaped structures go through the transformation of the (567) facets into (111) planes, then the etching planes deviate from (111) planes, exposing (443) planes.

Key words: surface and interface in the materials wet etching TMAH inverted pyramid-shape structures intersection angles between side planes and (100) plane

Received: 18 July 2011

ZTFLH:

TN405

Fund:

Supported by National Natural Science Foundation of China Nos.11005076 and 11075112, Open Fund of Key Laboratory of Radiation and Technology of Education Ministry of China Nos.2011–7 and 2011–6, and Doctoral Fund of Ministry of Education of China No. 20100181120112.

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1 A.G.Nassiopoulou, Porous silicon for sensor applications, Chemistry and Materials Science, 204(1), 189(2005)

2 Albert Birner, Ralf B. Wehrspohn, Ulrich M.G¨osele, Kurt Busch, Silicon-based photonic crystals, Advanced Materials, 13(6), 377(2001)

3 Y.B.Hua, T.B.Mei, L.Y.Ling, S.Z.Biao, S.X.Ning, Z.Yan, Process improvement of surface texturization of monocrystalline silicon for solar cells, Micronanoelectronic Technology, 46(11), 695(2009)

4 H.Seidel, L.Csepregi, A.Heuberger, H.BaumgSrtel, Anisotropic etching of crystalline silicon in alkaline solutions, Electrochem. Soc., 137(10), 3612(1990)

5 MA Qinghua, BAO Minhang, SHEN Shaoqun, HU Chengyu, Studies on the anisotropic etching characteristics in the TMAH–IPA–water system, Chinese Journal of Sensors and Actuators, 7(3), 1(1994)

(马青华, 鲍敏杭, 沈绍群, 胡澄宇, 四甲基氢氧化铵: 异丙醇: 水系统对硅的各向异性腐蚀, 传感技术学报, 7(3), 1(1994))

6 K.Biswas, S.Kal, Etch characteristics of KOH, TMAH and dual doped TMAH for bulk micromachining of silicon, Microelectronics Journal, 37(6), 519(2006)

7 A.Merlos, M.C.Acero, M.H.Bao, J.Bausells, J.Esteve, A study of the undercutting characteristics in the TMAH–IPA system, Micromechanics and Microengineering, 2(3), 181(1992)

8 Mitsuhiro Shikida, Takehiro Masuda, Daisuke Uchikawa, Kazuo Sato, Surface roughness of single-crystal silicon etched by TMAH solution, Sensors and Actuators, 90(3), 223(2001)

9 Chii-Rong Yang, Po-Ying Chen, Cheng-Hao Yang, Yuang- Cherng Chiou, Rong-Tsong Lee, Effects of various iontyped surfactants on silicon anisotropic etching properties in KOH and TMAH solutions, Sensors and Actuators, 119(1), 271(2005)

10 Malgorzata Kramkowska, Irena Zubel, Silicon anisotropic etching in KOHand TMAHwith modified surface tension, Procedia Chemistry, 1(1), 774(2009)

11 Les M. Landsberger, Sasan Naseh, Mojtaba Kahrizi, Makarand Paranjape, On hillocks generated during anisotropic etching of Si in TMAH, Microelectromechanical Systems, 5(2), 106(1996)

12 Song-Sheng Tan, M Reed, Hongtao Han, R Boudreau, Process induced hillocks defects on anisotropic etched silicon, Micromechanics and Microengineering, 4(3), 233(1994)

13 RONG Yonghua, Introduction to the Analysis of Electron Microscopy (Beijing, Higher Education Press, 2006) p.428–437

(戎咏华, 分析电子显微学导论 (北京, 高等教育出版社, 2006) p.428--437)

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