A Review on Grain Boundary Segregation, Interfacial Phase and Mechanical Property Adjusting-controlling for Nanocrystalline Materials

doi:10.11901/1005.3093.2021.599

Chinese Journal of Materials Research

2023, Vol. 37

Issue (5): 321-331 DOI: 10.11901/1005.3093.2021.599

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A Review on Grain Boundary Segregation, Interfacial Phase and Mechanical Property Adjusting-controlling for Nanocrystalline Materials

JIANG Shuimiao¹^,², MING Kaisheng¹^,², ZHENG Shijian¹^,²(

)

^1.School of Materials Science and Engineering, Hebei University of Technology, Tianjin 300401, China
^2.Tianjin Key Laboratory of Materials Laminating Fabrication and Interface Control Technology, Tianjin 300401, China

Cite this article:

JIANG Shuimiao, MING Kaisheng, ZHENG Shijian. A Review on Grain Boundary Segregation, Interfacial Phase and Mechanical Property Adjusting-controlling for Nanocrystalline Materials. Chinese Journal of Materials Research, 2023, 37(5): 321-331.

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Abstract

The theory of grain boundary segregation was introduced, and three classical models of equilibrium segregation were summarized, while the theory related with grain boundary segregation engineering and the influence of grain boundary segregation on mechanical properties of materials were also briefly introduced. The relationship between grain boundary segregation and interface phase was discussed. The interfacial phases can be divided into six types according to the structural characteristics of interfaces in atomic scale, and the interfacial phase transitions determined by grain boundary thermodynamics were introduced. The interfacial phase transformation leads to the formation of new structures at grain boundaries, which may either improve the properties of materials or have adverse effects on them. The type VI interfacial phase at grain boundary (such as amorphous intergranular film) inhibits the nucleation of crack and reduces the damage of grain boundary, however, the type II and type III interfacial phases that weaken the atomic bond strength at the grain boundary (such as the bi-atomic interfacial phase at the grain boundary of Ni alloy with Bi component) produce grain boundary embrittlement. At the same time, nanocrystalline metal materials have high strength but poor thermal stability and plasticity, which has always been the focus of research. The interfacial phase can significantly reduce grain boundary energy and pin grain boundaries rather than segregates at grain boundaries. Therefore, the interfacial phase can significantly improve the thermal stability of nanocrystalline metallic materials. As the sites for nucleation and absorption of dislocations, the amorphous intercrystalline film (VI interface phase) can improve the ductility of nanomaterials. Whilst, amorphous intercrystalline films can improve the shear resistance of grain boundaries and inhibit grain sliding and rotation of nanocrystalline metallic materials, thus further improving the plasticity of nanocrystalline metallic materials. Finally, the effects of grain boundary segregation and interface on material properties were also summarized and the future development was prospected.

Key words: review foundational discipline in materials science grain boundary segregation complexion thermal stability mechanical properties

Received: 22 October 2021

ZTFLH:

TB331

Fund: National Natural Science Foundation of China(51771201);National Natural Science Foundation of China(52071124);Natural Science Foundation of Hebei Province(E2021202135);Natural Science Foundation of Tianjin(20JCZDJC00440);the Open Research Fund from the State Key Laboratory of Rolling and Automation, Northeastern University(2020RALKFKT002)

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Fig.1 Example and model diagram of six Dillon Hammer complexions^{[17, 21, 26, 27]}, (a~c) clean grain boundry, (d~f) monolayer, (g~i) bilayer, (j~l) trilayer, (m~o) nanolayer, (p~r) wetting

Fig.2 Plot of free energy of grain boundary versus temperature and pressure^[28]

Fig.3 Effect of different grain boundary structures on dislocation emission and slip of Cu-Zr alloys^[34](a) quilibrium grain boundary structures obtained using the hybrid MD/MC method, (b) atomic shear stress distribution during dislocation propagation simulations at 3% applied shear strain，black arrows denote local regions of low stress, (c) relative changes of the critical stress required for dislocation emission and propagation, as measured by the MD simulation

Fig.4 Improving the interfacial stability of nanostructured materials by introducing different complexions^{[39, 40]} (a, b) three-dimensional atom probe tomography (APT) reconstruction of the nanograined Ni-Mo alloy, (c) softening and hardening in the nanograined Ni-Mo alloys, Cu/Nb composites with amorphous complexions, (d) TEM image of Cu/Nb composite, (e) TEM image of amorphous complexions, (f) schematic diagram of interaction between amorphous complexions and dislocations

Fig.5 Cumulative plot of K_eff via the J integral method of Al₂O₃ sample with different complexions^[41]

Fig.6 Crack nucleation and extension simulated in Cu-Zr alloy during shear deformation^[44](a) clean grain boundaries, (b) complexions with the thickness of 1 nm, (c) complexions with the thickness of 3.8 nm

Fig.7 Complexions of polycrystalline Ni grain boundaries with Bi-rich diatomic layers^[17] (a) initial grain boundary, (b) (c) brittle fracture along the grain boundary, (d) grain boundary model

Fig.8 Cu-Zr alloys with different complexions showing different deformation behaviour after compression^[35] (a) pure Cu, (b) Cu-Zr alloy with ordered complexions, (c) Cu-Zr alloy with amorphous complexions

Fig.9 Grain boundary motion under constant driving force^[16]

Fig.10 Interfacial atomic structure of BaTiO₃^[47](a, b) high-resolution HAADF-STEM images of the interfacial phase at (111) grain boundaries on the [110] and [12 $1 ¯$ ] crystal band axes, (c) EDS showing Ti-rich interfacial phase, (d) EFTEM showing Ti-rich intergranular phase

Fig.11 Characterisation of the Ni-W alloy interfacial phase and grain size distribution at different temperatures^[54] (a, b) high resolution TEM images of 1 nm thick amorphous intergranular films, (c) grain size analysis of the Ni-6%W (atomic fraction) electrodeposited alloys after annealing for 1 h at different temperatures

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