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Effect of Extrusion Temperature on Strength and Fracture Toughness of an Al-Zn-Mg Alloy |
DENG Yunlai1,2,**( ), WANG Yafeng1,2, LIN Huaqiang1,3, YE Lingying1,2, LIU Shengdan1,2, TAN Qian1,2, ZHANG Xinming1,2 |
1. School of Materials Science and Engineering, Central South University, Changsha 410083, China 2. The Key Laboratory of Nonferrous Materials Science and Engineering of Ministry of Education, Central South University, Changsha 410083, China 3. National Engineering Research Center for High-speed EMU, CSR Qingdao Sifang Co., Ltd., Qingdao 266111, China |
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Cite this article:
DENG Yunlai, WANG Yafeng, LIN Huaqiang, YE Lingying, LIU Shengdan, TAN Qian, ZHANG Xinming. Effect of Extrusion Temperature on Strength and Fracture Toughness of an Al-Zn-Mg Alloy. Chinese Journal of Materials Research, 2016, 30(2): 87-94.
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Abstract The effect of extrusion temperature on the tensile properties and fracture toughness of an Al-Zn-Mg alloy was investigated by optical microscopy, scanning electron microscopy, transmission electron microscopy, tensile tests and Kahn tear tests. The results showed that after extrusion the alloy possesses a surface layer composed of fine equiaxed grains with higher toughness in the L-T orientation than that of its center layer, which composed of fiber-like texture and recrystallized grains, while the tensile strength of the center layer is higher than that of the surface layer. When the extrusion temperature increases from 440-450℃ to 480-490℃, the dynamic recrystallization becomes more serious, and the tensile properties and fracture toughness become lower and higher respectively. After aging the precipitates in grains become smaller and the precipitates at grain boundaries are coarsening and discontinuous. Taking the central layer for example, the volume fraction of recrystallized grains increases from 14.8% to 52.3%, correspondingly σ0.2 increases from 280 MPa to 314 MPa, while UIE decrease from 229 Nmm-1 to 204 Nmm-1.
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Received: 13 January 2015
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Fund: *Supported by the National Basic Research Program of China No. 2012CB619500. |
About author: **To whom correspondence should be addressed, Tel: 15200801800, Email: luckdeng@csu.edu.com |
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