高致密高包覆率银包铜粉的制备和性能

doi:10.11901/1005.3093.2017.578

材料研究学报

2018, Vol. 32

Issue (10): 775-781 DOI: 10.11901/1005.3093.2017.578

研究论文

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高致密高包覆率银包铜粉的制备和性能

武博¹, 朱晓云^1,³(

), 曹梅², 龙晋明³

1 昆明理工大学材料科学与工程学院昆明 650093
2 昆明理工大学理学院昆明 650093
3 昆明贵信凯科技有限公司昆明 650093

Preparation and Properties of High Density and High Coverage Silver-coated Copper Powder

Bo WU¹, Xiaoyun ZHU¹(

), Mei CAO², Jinming LONG³

1 School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China
2 School of Science, Kunming University of Science and Technology, Kunming 650093, China
3 Kunming Guixinkai Science and Technology Ltd, Kunming 650093, China

引用本文:

武博, 朱晓云, 曹梅, 龙晋明. 高致密高包覆率银包铜粉的制备和性能[J]. 材料研究学报, 2018, 32(10): 775-781.
Bo WU, Xiaoyun ZHU, Mei CAO, Jinming LONG. Preparation and Properties of High Density and High Coverage Silver-coated Copper Powder[J]. Chinese Journal of Materials Research, 2018, 32(10): 775-781.

全文: PDF(3543 KB) HTML

摘要:

采用复合化学镀方法制备高致密、高包覆率的银包铜粉,使用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、管式高温烧结炉和数字欧姆表表征了银包铜粉的物相组成、表面形貌、抗氧化性和导电性。结果表明：当在铜粉表面化学镀银时,在镀液中添加适量的纳米Ag制备的银包覆层致密性好、包覆率高,镀覆效果比未加纳米Ag时的好,银包铜粉具有良好的抗氧化性和导电性。

关键词 ：复合材料, 银包铜粉, 复合化学镀, 高致密性, 高包覆率

Abstract：

Novel Ag-coatings of high density and high coverage were prepared on Cu-powders via composite electroless plating. Then the phase composition, surface morphology, oxidation resistance and electrical conductivity of the Ag-coated Cu-powder were characterized by means of X-ray diffractometer (XRD), scanning electron microscopy (SEM), high temperature oxidation test and digital ohmmeter respectively. The results show that when a proper amount of nano-Ag particulate was added to the plating electrolyte, the chemical deposition of Ag-coating of high density and high coverage can be facilitated on the surface of Cu-powder, besides,such nano-Ag particulate containing electrolyte presents better plating effect than that without adding nano-Ag particulate. Furthermore, the Ag-coated Cu- powder has good oxidation resistance and electrical conductivity.

Key words： composite silver-coated copper powder composite electroless plating high density high coverage

收稿日期: 2017-09-29

ZTFLH:

TG146

基金资助:云南省科技型中小企业技术创新资金(2017EH016),昆明理工大学分析测试基金(2016M20152230070)

作者简介:

作者简介武博,男,1990年生,硕士生

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https://www.cjmr.org/CN/10.11901/1005.3093.2017.578 或 https://www.cjmr.org/CN/Y2018/V32/I10/775

图1 银包铜粉制备工艺和测试流程

图2 不同纳米Ag添加量银包铜粉的SEM形貌

图3 银包铜粉的线扫描元素分布图

图4 银包铜粉镀层的SEM形貌

图5 未添加纳米Ag和添加纳米Ag银包铜粉银镀层的物理生长模型

图6 银包铜粉的XRD图谱

表1 银包铜粉的特征峰强度比

图7 镀层的沉积生长过程示意图

图8 镀层的包覆效果示意图

图9 不同银含量复合化学镀银包铜粉的SEM形貌

表2 银包铜粉的抗氧化性

图10 银包铜粉的导电性

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