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磁控溅射铜膜与基底结合强度的分析研究* |
李佳君1, 刘浩1, 左永刚1, 白旸1, 袁禾蔚1, 何其宇2, 姜龙2, 郭辉2, 孙振路2, 陈广超1 |
1. 中国科学院大学材料科学与光电技术学院 北京 100049 2. 河北省科学院激光所 石家庄 050081 |
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Analysis of Adhesive Strength between Magnetron Sputtered Copper Films and Substrate |
LI Jiajun1, LIU Hao1, ZUO Yonggang1, BAI Yang1, YUAN Hewei1, HE Qiyu2, JIANG Long2, GUO Hui2, SUN Zhenlu2, CHEN Guangchao1,** |
1. College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China 2. Hebei Institute of Laser, Shijiazhuang 050081, China |
引用本文:
李佳君, 刘浩, 左永刚, 白旸, 袁禾蔚, 何其宇, 姜龙, 郭辉, 孙振路, 陈广超. 磁控溅射铜膜与基底结合强度的分析研究*[J]. 材料研究学报, 2016, 30(8): 634-640.
Jiajun LI,
Hao LIU,
Yonggang ZUO,
Yang BAI,
Hewei YUAN,
Qiyu HE,
Long JIANG,
Hui GUO,
Zhenlu SUN,
Guangchao CHEN.
Analysis of Adhesive Strength between Magnetron Sputtered Copper Films and Substrate[J]. Chinese Journal of Materials Research, 2016, 30(8): 634-640.
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