Effect of Notch Orientation and Temperature on Thermal Fatigue Behavior of a Third-Generation Single Crystal Superalloy DD33

doi:10.11901/1005.3093.2023.178

Chinese Journal of Materials Research

2024, Vol. 38

Issue (2): 111-120 DOI: 10.11901/1005.3093.2023.178

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Effect of Notch Orientation and Temperature on Thermal Fatigue Behavior of a Third-Generation Single Crystal Superalloy DD33

ZHENG Mingrui¹^,², LI Yawei¹^,², LIU Jing¹^,², WANG Li¹(

), ZHENG Wei¹, DONG Jiasheng¹(

), ZHANG Jian¹, LOU Langhong¹

^1.Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
^2.School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China

Cite this article:

ZHENG Mingrui, LI Yawei, LIU Jing, WANG Li, ZHENG Wei, DONG Jiasheng, ZHANG Jian, LOU Langhong. Effect of Notch Orientation and Temperature on Thermal Fatigue Behavior of a Third-Generation Single Crystal Superalloy DD33. Chinese Journal of Materials Research, 2024, 38(2): 111-120.

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Abstract

The crack initiation and propagation behavior of a third-generation single crystal superalloy DD33 with V-notches of different orientations ([100], [210] and [110]) during thermal fatigue tests: samples were hold at different high-temperatures (1000^oC, 1100^oC and 1200^oC respectively) for 60 s and then quick quenching into water as one cycle, was investigated by OM, SEM and EDS. The results show that the thermal fatigue properties of DD33 show obvious anisotropy tested at different high-temperatures. The initiation and propagation behavior of thermal fatigue cracks in samples with different notch orientations show the dependence of crystallographic orientation. At 1000^oC/1100^oC/1200^oC, the [100] orientated specimens exhibit the best thermal fatigue performance. The thermal fatigue performance of the [210] oriented sample is the worst at 1100^oC, while the thermal fatigue performance of the [110] oriented sample is the worst at 1000^oC and 1200^oC. The thermal stress, oxidation, and the operation of slip systems result in the difference in crack growth rate of samples with different notch orientations.

Key words: metallic materials single crystal superalloy notch orientation thermal fatigue anisotropy oxidation

Received: 15 March 2023

ZTFLH:

TG132.32

Fund: Science Center for Gas Turbine Project(P2021-AB-IV-001-002);National Science and Technology Major Project(2017-VI-0019-0091)

Corresponding Authors: WANG Li, Tel: (024)23971276, E-mail: wangli@imr.ac.cn;
DONG Jiasheng, Tel: (024)23748882, E-mail: djs@imr.ac.cn

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	ZHENG Mingrui
	LI Yawei
	LIU Jing
	WANG Li
	ZHENG Wei
	DONG Jiasheng
	ZHANG Jian
	LOU Langhong

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https://www.cjmr.org/EN/10.11901/1005.3093.2023.178 OR https://www.cjmr.org/EN/Y2024/V38/I2/111

Table 1 Nominal composition of experimental alloy (mass fraction，%)

Fig.1 Schematic of thermal fatigue samples with different orientations. (a) [100]; (b) [210]; (c) [110]

Fig.2 Geometry and dimensions of specimens for thermal fatigue tests

Fig.3 Notch morphology, surface macroscopic morphology and microstructure morphology of samples with different orientations. (a, b, c) [100]; (d, e, f) [210]; (g, h, i) [110]

Fig.4 Dynamic curves of crack propagation for samples with different orientations (a) 1000^oC; (b) 1100^oC; (c) 1200^oC

Fig.5 Cycles required for thermal fatigue crack initiation of samples with different orientations

Fig.6 Thermal fatigue crack initiation of samples with different orientations after 120 cycles at 1000^oC. (a, b) [100]; (c, d) [210]; (e, f) [110]

Fig.7 Element distribution around crack tips of samples with [100] orientation at 1000^oC

Fig.8 Element distribution around crack tips of samples with [210] orientation at 1000^oC

Fig.9 Element distribution around crack tips of samples with [110] orientation at 1000^oC

Fig.10 SEM morphologies of the crack tip regions and overall cracks at 1100^oC after 210 cycles. (a, b, c) [100]; (d, e, f) [210]; (g, h, i) [110]

Fig.11 SEM morphologies of the crack tip regions and overall cracks at 1200^oC after 120 cycles (a, b, c) [100]; (d, e, f) [210]; (g, h, i) [110]

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