Influence of Surface Plastic Deformation on Diffusion Bonding of High Nb Containing TiAl Alloy

doi:10.11901/1005.3093.2014.479

Chinese Journal of Materials Research

2015, Vol. 29

Issue (5): 353-358 DOI: 10.11901/1005.3093.2014.479

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Influence of Surface Plastic Deformation on Diffusion Bonding of High Nb Containing TiAl Alloy

Xiansheng QI,Xiangyi XUE(

),Bin TANG,Chuanyun WANG,Hongchao KOU,Jinshan LI

State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, 710072, China

Cite this article:

Xiansheng QI,Xiangyi XUE,Bin TANG,Chuanyun WANG,Hongchao KOU,Jinshan LI. Influence of Surface Plastic Deformation on Diffusion Bonding of High Nb Containing TiAl Alloy. Chinese Journal of Materials Research, 2015, 29(5): 353-358.

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Abstract

Surface plastic deformation was applied onto a high Nb containing TiAl alloy by means of high energy shot peening (HESP), and then the influence of surface plastic deformation on diffusion bonding of the high Nb containing TiAl alloy was investigated. The results show that a deformed region with a depth of about 150 μm was produced by HESP. No recrystallization was observed in the deformed region during the bonding process. However, the bonding interface disappeared and large number of recrystallized grains was found near the bonding interface after post bonding heat treatment (PBHT) process. The results of shear test at room temperature reveal that HESP was beneficial to lower the bonding temperature and to ensure a shear strength 420 MPa for the bonding joints.

Key words: metallic materials high Nb containing TiAl alloy surface plastic deformation diffusion bonding shear strength

Received: 08 September 2014

Fund: ^*Supported by Natural Science Foundation of Shaanxi Province No. 2014JQ6216 and Fundamental Research Funds for the Central Universities No. 3102014KJJD031.

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	Xiansheng QI
	Xiangyi XUE
	Bin TANG
	Chuanyun WANG
	Hongchao KOU
	Jinshan LI

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https://www.cjmr.org/EN/10.11901/1005.3093.2014.479 OR https://www.cjmr.org/EN/Y2015/V29/I5/353

Fig.1 Microstructure of high Nb containing TiAl alloy

Fig.2 Microstructure of cross section (a) and X-ray diffraction pattern of deformed surface (b)

Fig.3 Micro-hardness on cross section of deformed surface

Fig.4 Microstructure of bonding joint bonded at 1000℃-30 MPa-45 min (a) and 1100℃-30 MPa-45 min (b)

Table 1 Composition of recrystallized grain at bonding interface (%, atom fraction)

Fig.5 Microstructure near the bonding interface after HESP bonded at 1000℃-30 MPa-45 min (a) and 1100℃-30 MPa-45 min (b)

Fig.6 Schematic drawing of lamellar rotation (a) distribution of dislocation; (b) dislocation wall; (c) low angle boundary; (d) lamellar rotation

Fig.7 Microstructure near the bonding interface after PBHT (a) 1000℃-30 MPa-45 min, (b) 1100℃-30 MPa-45 min

Fig.8 Shear strength of diffusion bonded joint

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