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| Bonding and Insulating Properties of Silicate Inorganic Adhesive |
| ZHAO Yuhang, DUAN Deli, ZHANG Yuelai, WANG Peng, LI Shu |
| Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 |
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Cite this article:
ZHAO Yuhang DUAN Deli ZHANG Yuelai WANG Peng LI Shu. Bonding and Insulating Properties of Silicate Inorganic Adhesive. Chinese Journal of Materials Research, 2012, 26(6): 667-672.
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Abstract For studying the bonding and insulating properties of inorganic adhesive, different compositions of silicate adhesive samples were prepared in this paper. The morphologies of the solidified adhesives were observed by the microscope and SEM. The bonding force was determined by low-loaded tensile testing machine and the insulation resistance of sample was measured under various temperature and saturated vapor environment. The results indicated that the bonding-strength of sample is greatly improved by the decrescent SiO2/M2O modulus ratio of liquid composition, the wide sizes and distributions of the solid powders as well as the proper ratio between solid and liquid component. The insulating property of sample deteriorates with temperature rising, and sample with more content of alkali metal ion shows lower critical temperature and quicker downtrend. Sample’s insulating resistance obviously decreased when it was under saturated vapor environment, which might be greatly improved by heat treating, but it can also deteriorate by the increase of both alkali ion content and micro crack of adhesive.
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Received: 30 August 2012
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