The influence of stress on creep behavior of Ag particle enhancement SnCu based composite solder

Chin J Mater Res

2009, Vol. 23

Issue (1): 69-72 DOI:

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The influence of stress on creep behavior of Ag particle enhancement SnCu based composite solder

YAN Yanfu¹; XU Jian²; GUO Xiaoxiao¹; FENG Lifang¹; ZHAO Peifeng¹

1.Henan Key Laboratory of Advanced Non-Ferrous Metals; Luoyang 471003
2.725 Graduate School of China Shipping Heavy Industry Group Company; Luoyang 471039

Cite this article:

YAN Yanfu XU Jian GUO Xiaoxiao FENG Lifang ZHAO Peifeng. The influence of stress on creep behavior of Ag particle enhancement SnCu based composite solder. Chin J Mater Res, 2009, 23(1): 69-72.

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Abstract

Single shear lap creep specimens were developed using Ag particle-enhancement SnCu based composite solder to examine the influence of stress on creep behavior of the composite solder in this paper. Results show that the creep resistance of solder joints of particle enhancement 99.3Sn0.7Cu based composite solder is superior to that of 99.3Sn0.7Cu solder joints. At the same time, the creep rupture lifetime of the solder joints of the composite solders was decreased with the increasing of stresses and felt down faster than those of 99.3Sn0.7Cu solder joints.

Key words: foundational discipline in materials science creep rupture lifetime composite solder stress

Received: 18 February 2008

ZTFLH:

TG425

Fund:

Supported by 11th “Five-year Plan” State Science & Technology Support Projects No.2006BAF04B14 and Foundation of Henan Science & Technology Tackle Key Problems No.072102260016.

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