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材料研究学报  2008, Vol. 22 Issue (1): 107-112    
  论文 本期目录 | 过刊浏览 |
热压温度对C-SiC-B_4C复合材料性能的影响
喻亮; 茹红强; 蔡继东; 左良
东北大学材料各向异性与织构过程教育部重点实验室 沈阳
引用本文:

喻亮; 茹红强; 蔡继东; 左良. 热压温度对C-SiC-B_4C复合材料性能的影响[J]. 材料研究学报, 2008, 22(1): 107-112.

全文: PDF(1154 KB)  
摘要: 用热压烧结法制备C-SiC-B_4C复合材料,研究了热压温度对其显微组织和力学性能的影响.结果表明,材料的体积密度、抗折强度和断裂韧性均随着热压温度的升高而提高.在2000℃烧结的复合材料综合力学性能最佳,其体积密度、气孔率、抗折强度和断裂韧性分别达到2.81 g/cm~3、2.4%、236.7 MPa和5.4 MPa·m~(1/2).随着热压温度的提高,材料的组织经历了陶瓷相长大、C相变薄、C相和SiC逐渐致密化等过程.利用鳞片石墨C_(fg)易在压力下滑动在陶瓷基体上形成C_(fg)条状组织的特性,实现了材料的显微组织设计.碳陶复合材料的界面结合状态改善、C_(fg)条状结构和C_(fg)与陶瓷相的热膨胀不匹配是材料力学性能提高的主要原因.
关键词 复合材料C-SiC-B_4C鳞片石墨热压温度    
Key words
收稿日期: 1900-01-01     
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