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| 基于VOF/PLIC界面追踪方法的RTM工艺充模过程数值模拟 |
| 杨俊英1; 贾玉玺2; 丁妍羽2; 张国芳2 |
1.大连交通大学材料科学与工程学院 大连 116028
2.山东大学材料科学与工程学院 济南 250061 |
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| Numerical simulation of mold filling stage in resin transfer molding processes based on VOF/PLIC method |
| YANG Junying1; JIA Yuxi2; DING Yanyu2; ZHANG Guofang2 |
1.School of Materials Science & Engineering; Dalian Jiaotong University; Dalian 116028
2.School of Materials Science & Engineering; Shandong University; Jinan 250061 |
引用本文:
杨俊英 贾玉玺 丁妍羽 张国芳. 基于VOF/PLIC界面追踪方法的RTM工艺充模过程数值模拟[J]. 材料研究学报, 2009, 23(6): 622-627.
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Numerical simulation of mold filling stage in resin transfer molding processes based on VOF/PLIC method[J]. Chin J Mater Res, 2009, 23(6): 622-627.
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