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| Low cycle fatigue behavior of Sn-3.8Ag-0.7Cu lead-free solder |
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Cite this article:
;. Low cycle fatigue behavior of Sn-3.8Ag-0.7Cu lead-free solder. Chin J Mater Res, 2004, 18(1): 11-11.
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Abstract Low cycle fatigue tests of Sn-3.8Ag-0.7Cu lead-free solder alloy were carried out under total strain amplitude control at room temperature. The fatigue behavior of the solder alloy was characterized by the cyclic stress-strain hysteresis loops, cyclic stress responses, cyclic stress-strain curves, and the relationship between strain and fatigue life. At higher strain amplitudes (>1%), the solder alloy exhibited cycle-dependent softening. At lower strain amplitudes (? 0.4%), stable cyclic response was observed over a significant portion of the fatigue life. The fatigue life of the solder alloy followed the Coffin-Manson equation, from which relevant fatigue parameters were determined. The fatigue behavior of the solder alloy was related to the fatigue-induced microstructural variations and the fracture mechanism.
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Received: 06 May 2003
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