1 D.M.Jacobson, S.P.S.Sangha, A novel lightweight microwave packaging technology, IEEE Trans. CPMT (A), 21(3), 515(1998)
2 Carl Zweben, Advances in composite materials for thermal management in electronic packaging, JOM, 50(6), 47(1998)
3 Carl Zweben, Metal–matrix composites for electronic packing, JOM, 44(7), 15(1992)
4 CAI Yang, ZHENG Ziqiao, LI Shichen, FENG Xi, The technique and mechanism to fabricate lightweight Si–Al composites for electronic packaging, Powder Metallurgy Technology, 22(3), 168(2004)
(蔡 杨, 郑子樵, 李世晨, 冯 曦, 轻质Si--Al电子封装材料制备工艺的研究, 粉末冶金技术,  22(3), 168--172(2004))
5 YANG Fuliang, GAN Weiping, CHEN Zhaoke, A few preparation methods and their delication mechanism for high–silicon aluminum alloy, Materials Review, 19(5), 42(2005)
(杨伏良,甘卫平,陈招科, 高硅铝合金几种常见制备方法及其细化机理, 材料导报,  19(5), 42(2005))
6 ZHANG Henghua, DUAN Haili, SHAO Guangjie, XU Luoping, Microstructure and mechanical properties of hypereutectic
Al–Si alloy modified with Cu–P, Rare Metals, 27(1), 59(2008)
7 H.G.Jeong, D.J.Yoon, E.Z.Kim, H.J.Park, K.H.Na, The influence by hydrostatic extrusion on the microstructure and extrudability of the IM processed hypereutectic Al–Si–X alloys, Journal of Materials Processing Technology, 130–131, 438(2002)
8 LIN Feng, FENG Xi, LI Shichen, REN Xianjing, JIA Xianshang, Research on high performance novel electronic packaging materials of silicon–based aluminum, Materials Review, 20(3), 107(2006)
(林 锋, 冯  曦, 李世晨, 任先京, 贾贤赏, 新型硅基铝金属高性能电子封装复合材料研究, 材料导报,  20(3), 107(2006))
9 Y.Y.Chen, D.D.L.Chung, Silicon–aluminium network composites fabricated by liquid metal infiltration, Journal of Material Science, 29(23), 6069(1994)
10 C.W.Chien, S.L.Lee, J.C.Lin, M.T.Jahn, Effects of Sip size and volume fraction on properties of Al/Sip composites, Material Letters, 52(4–5), 334(2002)
11 YANG Fuliang, GAN Weiping, CHEN Zhaoke, LIU Hong, Microstructures and mechanical properties of high–silicon aluminum alloy fabricated by rapid solidification/powder metallurgy, The Chinese Journal of Nonferrous Metals, 14(10), 1717(2004)
(杨伏良, 甘卫平, 陈招科, 刘 泓, 快速凝固/粉末冶金制备高硅铝合金材料的组织与力学性能, 中国有色金属学报,  14(10), 1717(2004))
12 ZHAN Datong, LI Yuanyuan, LUO Zongqiang, QIU Cheng, Hot extrusion process of rapidly solidified hypereutectic aluminum–silicon alloy powder, The Chinese Journal of Nonferrous Metals, 11(1), 6(2001)
(张大童, 李元元, 罗宗强, 邱诚, 快速凝固高硅铝合金粉末的热挤压过程, 中国有色金属学报,  11(1), 6(2001))
13 D.M.Jacobson, A.J.W.Ogilvy, Spray–deposited Al–Si (Osprey CE) alloys and their properties, Material Wissenschaft und Werkstofftechnik, 34(4), 381(2003)
14 Feng Wang, Baiqing Xiong, Yonggan Zhang, Baohong Zhu, Hongwei Liu, Yanguang Wei, Microstructure, thermo–physical and mechanical properties of spray– deposited Si–30Al alloy for electronic packaging application, Materials Characterization, 59, 1455(2008)
15 TIAN Chong, CHEN Guiyun, YANG Lin, ZHAO Jiuzhou, Microstructures and properties of Si–Al alloy for electronic packaging prepared by spray deposition technique, Journal of Functional Materials and Devices, 12(1), 54(2006)
(田 冲, 陈桂云, 杨 林, 赵九洲, 喷射沉积硅铝电子封装材料的组织与性能, 功能材料与器件学报,  12(1), 54(2006))
16 Jung–II Lee, Tae–Whan Hong, II–Ho Kim, Soon–Chul Ur, Young–Geun Lee, Sung–Lim Ryu, Syntheses and evaluations of microstructure properties on Al–(50,60,70 mass%)Si systems by mechanical alloying, Material Science Forum, 449(4), 249(2004)
17 Li Yuanyuan, ZHANG Datong, XIAO Zhiyu, Influence of high–energy ball milling on Al–30Si powder and ceramic particulate, Transactions of Nonferrous Metals Society of China, 10(3), 324(2000)
18 YANG Fuliang, YI Danqing, High–energy ball milling and characterization of Al–Si alloy powders, J. Cent. South Univ. (Science and Technology), 39(1), 29(2008)
(杨伏良, 易丹青, Al--Si合金粉末的高能球磨及其表征, 中南大学学报,  39(1), 29(2008)
19 Barin Ihsan, translated by CHENG Nailiang, NIU Sitong, XU Guiying, Thermochemical Data of Pure Substances (Beijing, Science Press, 2003) p.17–1480
(伊赫桑, 巴伦主编, 程乃良, 牛四通, 徐桂英译,  纯物质热化学数据手册 (北京, 科学出版社, 2003) p.17--1480)
20 QIU Chengjun, WANG Yuanhua, WANG Yijie, Material Physical Properties (Harbin, Harbin Industry University Press, 2003) p.2–42
(邱成军, 王元化, 王义杰, 材料物理性能(哈尔滨, 哈尔滨工业大学出版社, 2003) p.2--42)
21 ZHANG Jishan, New spray formed light weighted Si–Al electronic packaging materials with low thermal expansion and high heat conducing, Materials Review, 16(9), 1(2009)
(张济山, 新型喷射成形轻质、高导热、低膨胀Si--Al电子封装材料, 材料导报,  16(9), 1(2002))