Research Progress of Repair Technology for Surface Defects of Single Crystal Superalloy

doi:10.11901/1005.3093.2020.303

Chinese Journal of Materials Research

2021, Vol. 35

Issue (3): 161-174 DOI: 10.11901/1005.3093.2020.303

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Research Progress of Repair Technology for Surface Defects of Single Crystal Superalloy

LANG Zhenqian, YE Zheng, YANG Jian, HUANG Jihua(

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School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China

Cite this article:

LANG Zhenqian, YE Zheng, YANG Jian, HUANG Jihua. Research Progress of Repair Technology for Surface Defects of Single Crystal Superalloy. Chinese Journal of Materials Research, 2021, 35(3): 161-174.

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Abstract

Single crystal superalloy has excellent properties at elevated temperature, but it is burdened with high manufacturing costs. The repair of single crystal superalloy by welding and joining has been an important research subject in the field of single crystal superalloy. In this paper, a comprehensive overview on the development of surface defects repair technology in the field of single crystal superalloy was presented, and the effect of repair technologies (including fusion welding, brazing and transient liquid phase bonding) on the microstructure and mechanical properties of the repaired zone was summarized. The problems and limitations of the present repair technologies were analyzed. Finally, the future development direction of repair technology was also proposed.

Key words: review metallic materials single crystal superalloy repair technology surface defects welding and brazing

Received: 21 July 2020

ZTFLH:

TG47

Fund: National Defense Pre-research Foundation of China(61409230313)

About author: HUANG Jihua, Tel: (010)62334859, E-mail: jhhuang62@sina.com

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	Zhenqian LANG
	Zheng YE
	Jian YANG
	Jihua HUANG

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https://www.cjmr.org/EN/10.11901/1005.3093.2020.303 OR https://www.cjmr.org/EN/Y2021/V35/I3/161

Fig.1 Morphology of crack growth in CMSX-4 single crystal superalloy

Fig.2 Morphology of corrosion defect and extension crack

Fig.3 Optical micrograph of spot welds made on TMS-75 single-crystal nickel-base superalloy under (a) a rapid cooling condition and (b) a slow cooling condition

Fig.4 Optical micrographs of (a) transverse cross section and (b) top surface of PWA1480 electron beam welds

Fig.5 Schematic representation of (a) the melt pool during laser remelting and (b) longitudinal section of the melt pool

Fig.6 Schematic of the coaxial laser cladding process

Table 1 Chemical composition of several single crystal superalloys and cladding materials (mass fraction, %)

Fig.7 Microstructure of the cross section view of the thin-wall samples with different layers. (a), (b) and (c) are EBSD mapping, optical microstructures of as-deposited sample with one layer, while (d), (e), and (f) are EBSD mapping, optical microstructures of as-deposited sample with three layers

Fig.8 Schematic illustration for producing different sub-strate orientations via the rotations around [100](x)-, [010](y)-, and [001](z)-axis respectively

Fig.9 Transverse-section micrographs for different orientations: (a) the initial substrate orientation; (b) 45° via [001]-axis rotation; (c) -15°, 15°, -30°, 30°, -45° and 45° via [010]-axis rotation

Fig.10 Melt-pool model of single crystal superalloy repair zone

Fig.11 The experimental and predicted dendrite growth regions for the [100]-240W-1 mm/s laser-weld condition

Fig.12 Variations in the distribution of the predicted volume fraction of SGs under with orientation for (a) x-axis clockwise rotation, (b) y-axis counterclockwise rotation, (c) y-axis clockwise rotation and (d) z-axis clockwise rotation

Fig.13 Processing map showing the microstructure as a function of laser power P and (a) preheating temperatures T₀, (b) beam scanning speed V_b

Fig.14 Solidification structure under various temperature gradient and solidification speed

Fig.15 Schematic representation of the solidification cracking mechanism

Fig.16 Light microscope images of Rene N5 single crystal repaired with (a) Ni-36.6Mn and (b) D-15

Fig.17 Nominal stages in TLP bonding process: (a) initial condition; (b) dissolution; (c) isothermal solidification; (d) completion of isothermal solidification; (e) solid state homogenisation; (f) final condition

Fig.18 Schematic illustrations of the composition profile and the supercooling zone ahead of the solid /liquid interface: (a), (c), and (e) the composition profile across the interface with the increase of the time; (b), (d), and (f) the temperature distribution and the supercooling zone

Fig.19 The microstructure of the repaired zone (initial size is 300 μm) after holding for: (a) 5 min, (b) 35 min, (c) 12 h, (d) 50 h, (e) 60 h

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