Corrosion Behavior of Pure Copper in Simulated Acid Rain of Different pH

doi:10.11901/1005.3093.2014.457

Chinese Journal of Materials Research

2015, Vol. 29

Issue (1): 60-66 DOI: 10.11901/1005.3093.2014.457

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Corrosion Behavior of Pure Copper in Simulated Acid Rain of Different pH

Wanli ZHONG¹(

),Ming NIE¹,Yongchun LIANG¹,Yuantai MA^2,^**,Ying LI²

1. Electric Power Research Institute of Guangdong Power Grid Corporation, Guangzhou 51000, China
2. Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

Cite this article:

Wanli ZHONG,Ming NIE,Yongchun LIANG,Yuantai MA,Ying LI. Corrosion Behavior of Pure Copper in Simulated Acid Rain of Different pH. Chinese Journal of Materials Research, 2015, 29(1): 60-66.

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Abstract

The corrosion behavior of pure copper in simulated acid rain of different pH was investigated by using electrochemistry impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS) as well as SEM. The results show that the impedances of pure copper in simulated acid rain of different pH present various characteristic, indicating the different corrosion mechanisms. The results of XPS show that cuprous oxide only form on the surface of pure copper in pH=3 solution and cupric oxide only exist in pH=5 solution as well as the mixture of both oxides appear in pH=6 solution. The diffusion of O₂and H⁺ through solution may influence the corrosion process of pure copper. In low pH solution, the diffusion of dissolved oxygen through double electric layer is the rate-controlling step due to the promotion of the hydrogen ion. With increase of pH value, the oxygen of depolarization effect mainly control the corrosion process of pure copper without the effect of hydrogen ion.

Key words: metalic materials materials failure and protection pure copper acid rain corrosion diffusion

Received: 06 May 2014

Fund: *Supported by Guangdong Power Grid Corporation No.K-GD2013-0498002-001.

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	Wanli ZHONG
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https://www.cjmr.org/EN/10.11901/1005.3093.2014.457 OR https://www.cjmr.org/EN/Y2015/V29/I1/60

Fig.1 Impedance spectroscopy of pure copper in simulated acid rain of pH=3 (a) Nyquist plot, (b) Bode plot

Fig.2 Impedance spectroscopy of pure copper in simulated acid rain of pH=5 (a) Nyquist plot, (b) Bode plot

Fig.3 Impedance spectroscopy of pure copper in simulated acid rain of pH=6: (a) Nyquist plot; (b) Bode plot

Table 1 Fitting results of EIS in pH=3 solutions

Table 2 Fitting results of EIS in pH=5 solutions

Table 3 Fitting results of EIS for pH=6 solutions

Fig.4 Equivalent circuits for EIS in Fig.1-3

Fig.5 Cu2p XPS of copper oxide film on surface of pure copper in different time exposed to simulated acid rain (a) 25 h, (b) 75 h

Fig.6 CuLMM Auger spectra of pure copper in different time exposed to simulated acid rain

Fig.7 MicrograpHs for copper surfaces exposed to simulated acid rain of pH=3 during of various period (a) 25 h, (b) 50 h, (c) 75 h

Fig.8 Micrographs for copper surfaces exposed to simulated acid rain of pH=5 during of various period (a) 25 h, (b) 50 h, (c) 75 h

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