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| Effects of Electroless Nickle Immersion Gold Protective Finish of Cu on the Reliability of the Lead--free Solder Joint |
| ZHANG Ruihong; ZHAO Ran; GUO Fu |
| The College of Materials Science and Engineering; Beijing University of Technology; Beijing 100124 |
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Cite this article:
ZHANG Ruihong ZHAO Ran GUO Fu. Effects of Electroless Nickle Immersion Gold Protective Finish of Cu on the Reliability of the Lead--free Solder Joint. Chin J Mater Res, 2010, 24(2): 137-143.
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Abstract The effects of Electroless nickel immersion gold (ENIG) on the interfacial reaction and solder joints reliability was investigated in this paper. The results show that (NiyCu 1−y) 3Sn4 forms at the Sn–3.5Ag/ENIG (Ni)/Cu, while (CuxNi 1−x)6 Sn5 forms at the Sn–3.0Ag–0.5Cu/ENIG/Cu during the reflow. The composition and morphology of the interfacial intermetallic compounds (IMCs) show strong dependency on the Cu concentration in the solder joint. The Ni layer in the ENIG can retard the excessive growth of interfacial IMCs which is the culprit of the solder joints failure during aging. The Au layer in ENIG exerts little influence on the interfacial reaction but reacts with Sn in the solder matrix during the reflow. In the stage of aging the Au migrates towards the interface and in turn changes the composition of the interfacial IMCs as well as the shear strength of the solder joint.
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Received: 11 January 2010
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| Fund: Supported by Beijing Natural Science Foundation Program and Scientific Research Key Program of Beijing Municipal Commission of Education No.KZ200910005004. |
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