Dynamic Recrystallization and Microstructure Evolution Mechanism of GH4169 Alloy

doi:10.11901/1005.3093.2021.679

Chinese Journal of Materials Research

2023, Vol. 37

Issue (3): 211-218 DOI: 10.11901/1005.3093.2021.679

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Dynamic Recrystallization and Microstructure Evolution Mechanism of GH4169 Alloy

YU Sen¹, CHEN Leli¹, LUO Rui¹^,³(

), YUAN Zhizhong¹, WANG Shuang¹, GAO Pei¹^,³, CHENG Xiaonong¹

^1.School of Material Science and Engineering, Jiangsu University, Zhenjiang 212013, China
^2.Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology, Nanjing Institute of Technology, Nanjing 211167, China
^3.Jiangsu Yinhuan Precision Steel Tube Co., Ltd., Yixing 214203, China

Cite this article:

YU Sen, CHEN Leli, LUO Rui, YUAN Zhizhong, WANG Shuang, GAO Pei, CHENG Xiaonong. Dynamic Recrystallization and Microstructure Evolution Mechanism of GH4169 Alloy. Chinese Journal of Materials Research, 2023, 37(3): 211-218.

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Abstract

The dynamic recrystallization mechanism and microstructure evolution of superalloy GH4169 during isothermal compression by strain rate of 0.01~1 s^-1 at temperature within the range of 1000~1150°C were systematically investigated via Gleeble thermal simulation technology, EBSD, SEM and OM. The results show that the maximum deformation resistance of the alloy can reach 400 MPa by the desired deformation parameters. The power dissipation diagram and rheological instability diagram of GH4169 were plotted based on the dynamic material model, and the deformation parameters of 1020°C~1070°C and 0.03~0.63 s^-1, which were taken as the optimal processing interval for the GH4169 alloy. The evolution regularity of dynamic recrystallization during the deformation process of GH4169 was analysed. It is clear that the dynamic recrystallization is mainly initiated by the discontinuous dynamic recrystallization at grain boundaries of the original austenite, while the continuous dynamic recrystallization may be due to the nucleation induced through the continuous rotation of sub-grains. The evolution regularity of Σ3ⁿ non-coherent twin boundary was determined. The larger the volume fraction of dynamic recrystallization grains, the much smaller the size of grains and the higher the density of Σ3 non-coherent twin boundaries. The growth of dynamic recrystallization grains takes the precedence over the formation of Σ3ⁿ non-coherent twin boundary.

Key words: metallic materials superalloy GH4169 thermal deformation dynamic recrystallization Σ3ⁿ non-coherent twin boundary

Received: 07 December 2021

ZTFLH:

TG132.3+2

Fund: Opening Project of Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology(ASMA202002);China Postdoctoral Science Foundation(2019M661738)

Corresponding Authors: LUO Rui, Tel: 18796000354, E-mail: luoruiweiyi@163. com

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	YU Sen
	CHEN Leli
	LUO Rui
	YUAN Zhizhong
	WANG Shuang
	GAO Pei
	CHENG Xiaonong

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https://www.cjmr.org/EN/10.11901/1005.3093.2021.679 OR https://www.cjmr.org/EN/Y2023/V37/I3/211

Table 1 Main chemical composition of GH4169 alloy

Fig.1 Original structure OM of GH4169 alloy

Fig.2 True stress-true strain curve of GH4169 alloy under different thermal deformation parameters

Fig.3 Power dissipation diagram (a) and Rheological instability plot (b) for GH4169 alloy at ε=0.7

Fig.4 Microstructure of GH4169 alloy under different thermal deformation conditions OM (a) 1000℃-0.1 s^-1; (b) 1050℃-0.1 s^-1; (c) 1100℃-0.1 s^-1; (d) 1150℃-0.1 s^-1; (e) 1100℃-0.01 s^-1 and (f) 1050℃-1 s^-1

Fig.5 EBSD microstructure diagram under different thermal deformation parameters of GH4169 alloy (a) 1000℃-0.1 s^-1; (b) 1050℃-1 s^-1; (c) 1050-0.1 s^-1; (d) 1100℃-0.01 s^-1; (e) the distribution map of texture component within 10° of the <111> direction under 1000℃-0.1 s^-1 parameter and (f) IPF legend

Fig.6 Under 1000℃-0.1 s^-1 thermal processing parameters IPF map of selected area 1 (a); IPF map of extracted grains (b); PF map of selected areas A and B (c); A, B Poor crystallographic orientation of the selected area (d) and schematic diagram of the DDRX mechanism (e) for GH4169 alloy

Fig.7 GH4169 under the thermal processing parameters of 1000℃-0.1 s^-1 the IPF map of the selection area 1 (a); the GND diagram of the selection area 1 (b); 1100℃-0.01 s^-1 thermal processing parameters of the selection area 2 IPF diagram (c); KAM diagram of selection area 2 (d); Schematic diagram of CDRX mechanism (e) and GB diagram under thermal processing parameters of 1100℃-0.01 s^-1 (f)

Fig. 8 Σ3ⁿ grain boundary under different thermal deformation parameters of GH4169 (a) 1000℃-0.1 s^-1; (b) 1050℃-1 s^-1; (c) 1050-0.1 s^-1; (d) 1100℃-0.01 s^-1; (e) 1050℃-1 s^-1 selection area (f) Σ3ⁿ grain boundary density under various deformation parameters

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