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Etching Behavior of Tungsten under Irradiation of Low Energy and High Flux Hydrogen Ions |
XUAN Jingfan, FAN Hongyu( ), BAI Ying, HU Ruihang, LI Xinyang, TAO Wenchen, NI Weiyuan( ), NIU Jinhai |
Liaoning Key Laboratory of Plasma Technology, Dalian Minzu University, Dalian 116600, China |
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Cite this article:
XUAN Jingfan, FAN Hongyu, BAI Ying, HU Ruihang, LI Xinyang, TAO Wenchen, NI Weiyuan, NIU Jinhai. Etching Behavior of Tungsten under Irradiation of Low Energy and High Flux Hydrogen Ions. Chinese Journal of Materials Research, 2020, 34(9): 659-664.
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Abstract Regarding to conditions of the fusion-related tungsten (W) divertor, the etching behavior of polycrystalline W under the irradiation of low-energy and high-flux hydrogen ions, namely the flux of ca 1022 ions/m2·s, dose of 1.0×1026 ions/m2 and energy of 5~200 eV was investigated by means of scanning electron microscopy SEM with EBSD and conductive atomic force microscopy. The findings suggest that the sputtering yield of W is strongly dependent on the ions energy, the sputtering rate increases rapidly with the increase of H ions energy; After irradiation, a texture of parallel stripes with a special orientation for every grain may emerge on the irradiated surface, but the distribution of defects on both sides of every stripe is obviously different, which means that the etching of W surface is preferentially occur along a certain face of W crystal grains.
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Received: 17 April 2020
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Fund: National Natural Science Foundation of China(11405023);Natural Science Foundation of Liaoning Province(20180510006);Natural Science Foundation of Liaoning Province(2019-ZD-018);Dalian Science and Technology Star Project(2017RQ149);College Students Innovation Training Project of Dalian Minzu University(202012026596);“Taiyangniao” Student Research Project of Dalian Minzu University(tyn2020302) |
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