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THE WETTABILITY AND INTERFACE BONDING OF Co-Ti, Ti-Zr-Cu HIGH TEMPERATURE FILLERS ON Si_3N_4 CERAMIC |
LU Shanping; DONG Xiuzhong; WU Qing; GUO Yi (Institute of Metal Researeh; The Chinese Academy of Sciences; Shenyang 110015) |
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Cite this article:
LU Shanping; DONG Xiuzhong; WU Qing; GUO Yi (Institute of Metal Researeh; The Chinese Academy of Sciences; Shenyang 110015). THE WETTABILITY AND INTERFACE BONDING OF Co-Ti, Ti-Zr-Cu HIGH TEMPERATURE FILLERS ON Si_3N_4 CERAMIC. Chin J Mater Res, 1998, 12(3): 295-298.
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Abstract In this paper, the wettability experiments of Co-Ti, Ti-Zr-Cu high temperature fillers on Si3N4 ceramic were carried out. The interface between brazing alloys and ceramic was analysed by X-Ray diffraction. The brazing alloy does not wet the Si3N4 ceramic
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Received: 25 June 1998
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