Effect of Ti Seed Layer on the Texture and Surface Morphology of Cu Thin Films

doi:10.11901/1005.3093.2014.654

Chinese Journal of Materials Research

2015, Vol. 29

Issue (6): 417-421 DOI: 10.11901/1005.3093.2014.654

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Effect of Ti Seed Layer on the Texture and Surface Morphology of Cu Thin Films

Wei LI,Leng CHEN(

)

School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China

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Wei LI,Leng CHEN. Effect of Ti Seed Layer on the Texture and Surface Morphology of Cu Thin Films. Chinese Journal of Materials Research, 2015, 29(6): 417-421.

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Abstract

ABSTARCT Cu thin films were deposited by magnetron sputtering on SiO₂ substrate pre-coated without and with a thin Ti seed layer. Then the surface morphology and micro-texture of the films were characterized by means of electron back-scattered diffraction (EBSD) and atomic force microscope (AFM). The results show that the Cu thin film deposited on the Ti seed layer showed a highly oriented {111} fiber texture. Meanwhile, the generation probability of twins of the Cu thin films induced by annealing treatment could be decreased due to the existence of the Ti seed layer, but voids could occur on the Cu thin film.

Key words: metallic materials Cu thin film Ti seed layer texture surface morphology

Received: 07 November 2014

Fund: ^*Supported by National Natural Science Foundation of China No.51171018.

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https://www.cjmr.org/EN/10.11901/1005.3093.2014.654 OR https://www.cjmr.org/EN/Y2015/V29/I6/417

Fig.1 Pole figures for 20 nm thick Ti seed layer (density level: 2, 4, 6, 8)

Fig.2 Orientation imaging orientation of Cu thin films (a) without Ti seed layer, (b) with Ti seed layer, (c) orientation with reference

Fig.3 Inverse pole figure of Cu thin films without Ti seed layer (a) and with Ti seed layer (b)

Table 1 Crystal plane mismatches (%) between Cu, Ti and Si

Fig.4 Map of misorientation angle distribution

Fig.5 Micrograph of Cu thin films surface without Ti seed layer (a) and with Ti seed layer (b)

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