Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder

doi:10.11901/1005.3093.2020.408

Chinese Journal of Materials Research

2021, Vol. 35

Issue (8): 615-622 DOI: 10.11901/1005.3093.2020.408

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Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder

LI Lingmei¹, HUANG Huizhen¹(

), ZHANG Qinghuan¹, SHUAI Gewang²

^1.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China
^2.School of Aeronautical Manufacturing Engineering, Nanchang HangKong University, Nanchang 330063, China

Cite this article:

LI Lingmei, HUANG Huizhen, ZHANG Qinghuan, SHUAI Gewang. Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder. Chinese Journal of Materials Research, 2021, 35(8): 615-622.

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Abstract

The effect of P addition on the microstructure, oxidation resistance, wettability and corrosion resistance of Sn-9Zn-0.1S solder alloy were characterized via optical microscope observation, scanning electron microscopy (SEM) and X-ray diffractometer (XRD), as well as dross removal measurement at different temperatures, spreading area on Cu plate and weight loss measurement after immersion in HCl solution respectively. The results show that P addition can refine the lamellar eutectic microstructures, but coarsen the rod-like primary Zn-rich phases. The oxidation resistance and wettability of the solder can be firstly increased with the addition of P, then this effect reduces, and the optimal P content is 0.06% (mass fraction). At the same time, a suitable amount of P addition can also improve the corrosion resistance of Sn-9Zn-0.1S solder alloy by modifying its microstructure and increasing the density of corrosion products. It is found that the weight loss is the minimum when the P content is 0.1% (mass fraction).

Key words: metallic materials Sn-9Zn-0.1S lead-free solder oxidation resistance wettability corrosion resistance

Received: 27 September 2020

ZTFLH:

TG425

Fund: Natural Science Foundation of Jiangxi Province(20181BAB206010)

About author: HUANG Huizhen, Tel: 13177820150, E-mail: hzhuang@ncu.edu.cn

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	Lingmei LI
	Huizhen HUANG
	Qinghuan ZHANG
	Gewang SHUAI

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https://www.cjmr.org/EN/10.11901/1005.3093.2020.408 OR https://www.cjmr.org/EN/Y2021/V35/I8/615

Fig.1 Microstructures of SnZn-0.1S-xP solder alloys, x=(a) 0, (b) 0.02, (c) 0.06, (d) 0.10 and (e) 0.15

Fig.2 XRD patterns of SnZn-0.1S-xP solder alloys, x=(a) 0, (b) 0.06 and (c) 0.15

Fig.3 Effects of P content on the amount of oxide dross formed on SnZn-0.1S solder at 280℃ and 320℃

Fig.4 XRD patterns of oxide drosses formed on SnZn-0.1S-xP solder alloys at 320℃, x=(a) 0, (b) 0.06 and (c) 0.15

Fig.5 SEM surface morphologies of (a) SnZn-0.1S and (b) SnZn-0.1S-0.15P solders after oxidation at 320℃, enlarged views of the local areas marked in (c) Fig.5a and (d, e) Fig.5b

Table 1 The atomic percentages of main elements tested by EDS at the marked points in Fig.5 (%, atomic fraction)

Fig.6 Effects of P content on spreading area of SnZn-0.1S solder on Cu substrate at different temperatures

Fig.7 Mass loss curves of SnZn-0.1S-xP solders in HCl solution

Fig.8 SEM surface morphologies of (a) SnZn-0.1S, (b) SnZn-0.1S-0.06P, (c) SnZn-0.1S-0.1P solders after immersion in HCl solution

Fig.9 XRD patterns of the corrosion products formed on (a) SnZn-0.1S, (b) SnZn-0.1S-0.06P and (c) SnZn-0.1S-0.1P solders after immersion in HCl solution with pH3.7

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