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Preparation of Graphene/Ni-Cu Alloy Composite on Ni-Cu Alloy Template Made by Selective Laser Melting |
LIU Zhufeng1, HUANG Yaodong1, YANG Xiao1, HE Yuanjing2, LI Zhaoqing1(), YAN Chunze1,3 |
1.State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China 2.The Open University of China Ministry of Information Technology (Engineering Center), Beijing 100039, China 3.Shenzhen Huazhong University of Science and Technology Research Institute, Shenzhen 518057, China |
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Cite this article:
LIU Zhufeng, HUANG Yaodong, YANG Xiao, HE Yuanjing, LI Zhaoqing, YAN Chunze. Preparation of Graphene/Ni-Cu Alloy Composite on Ni-Cu Alloy Template Made by Selective Laser Melting. Chinese Journal of Materials Research, 2021, 35(1): 1-6.
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Abstract The Ni-Cu alloy was prepared by selective laser melting (SLM) additive manufacturing technology, and then was used as substrate material for preparation of graphene/Ni-Cr composite by chemical vapor deposition (CVD). The optimized SLM forming parameters are: 200 W laser power, scanning speed 800 mm/s, single layer thickness 0.05 mm, and scanning pitch 0.06. mm. The as prepared Ni-Cu alloy has a density of up to 98.65% and a Rockwell hardness of 127.4 HV1. Then the CVD deposition process of graphene on the Ni-Cu alloy as substrate material was investigated. Results show that graphene can generate on the surface of Ni-Cu alloy at the reaction temperature range of 900~1100℃ and graphene/Ni-Cu alloy composite material was obtained. The thickness of the generated graphene layer gradually decreased with the increase of the reaction temperature. The thermal conductivity of the prepared graphene/Ni-Cu alloy composite material was characterized. The top graphene layer can increase the thermal diffusion coefficient of the Ni-Cu alloy material by 12.5%, which presents a good application prospect for the composite in fields such as radiator, thermal conductive materials and so on.
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Received: 25 May 2020
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Fund: National Natural Science Foundation of China(51671091);Science,Technology and Innovation Commission of Shenzhen Municipality(JCYJ20180213102634650) |
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