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| Preparation of Inlay Structure Diamond Films on Low-alloy Steel Substrate |
| YU Yun1 QIU Wanqi1** PAN Jianwei1 ZHOU Kesong1,2 |
1. School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640
2. New Materials Research Department, Guangzhou Research Institute of Non-ferrous Metals, Guangzhou 510640 |
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Cite this article:
YU Yun, QIU Wanqi, PAN Jianwei, ZHOU Kesong. Preparation of Inlay Structure Diamond Films on Low-alloy Steel Substrate. Chinese Journal of Materials Research, 2013, 27(2): 202-206.
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Abstract The diamond films were successfully fabricated on low-alloy steel substrate with Cr+Cu-Diamond interlayer deposited by magnetron sputtering for Cr/Cu and composite electroplating for Cu-diamond. The interfacial characteristics were investigated by indentation test and the surface morphology, phase structure and residual stress were analyzed by scanning electron microscopy (SEM), X-ray diffraction (XRD) and Raman spectroscopy. The results show that the Cr layer on low-alloy substrate prevents Fe from diffusing to Cu/diamond interface effectively by converting into (Cr, Fe)3C2 and (Cr, Fe)7C3 in CVD diamond growth. Low residual stress detected in diamond film can be attributed to the chromium-iron carbide and copper layer for relieve of phase transformation and thermal stress during CVD cooling process. Concentric cracks with no delaminate area on the periphery of the indentation in 441N load shows good adhesion between diamond and low-alloy steel substrate.
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