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| Effects of Multiple Reflows on Microstructure and Shear Properties of In3Ag Solder |
| MA Yunzhu, LI Yongjun, LIU Wensheng, HUANG Guoji |
| State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083 |
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Cite this article:
MA Yunzhu LI Yongjun LIU Wensheng HUANG Guoji. Effects of Multiple Reflows on Microstructure and Shear Properties of In3Ag Solder. Chin J Mater Res, 2012, 26(3): 321-326.
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Abstract The IMC layer microstructure and the composition of In3Ag solder joint were observed and analyzed using SEM and EDS, and the shear strength of solder joint was measured using mechanical testing machine. The effects of reflow soldering cycles on microstructure and shear property of In3Ag solder were investigated. The results show that with increase of the reflow soldering cycles, the quadratic phase AgIn2 in solder matrix grows prominently, and the shape changes from grain to long strip. The thickness of (Ag, Cu)In2 layer increases linearly, which is controlled by interfacial reaction rate and component diffusion rate. The shear strength of solder joints decreases with reflow soldering cycles increasing, and those decrease from 5.03MPa after one cycle to 2.58MPa after five cycles. The fracture type is ductile fracture in solder matrix after 1, 2 and 3 cycles. After five reflow soldering cycles, the fracture type belongs to the mixed fracture of toughness and brittleness.
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Received: 12 December 2011
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| Fund: Supported by National Supporting Project of China No.JPPT–115–2–1057. |
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