<strong>6H-SiC</strong>纳米磨削亚表面损伤机理的分子动力学研究

doi:10.11901/1005.3093.2024.355

材料研究学报

2025, Vol. 39

Issue (8): 603-611 DOI: 10.11901/1005.3093.2024.355

研究论文

本期目录 | 过刊浏览

6H-SiC纳米磨削亚表面损伤机理的分子动力学研究

耿瑞文¹, 杨志豇², 杨蔚华², 谢启明³, 游津京³, 李立军²(

), 吴海华¹

^1.三峡大学石墨增材制造技术与装备湖北省工程研究中心宜昌 443002
^2.三峡大学机械与动力学院宜昌 443002
^3.昆明物理研究所昆明 650223

Molecular Dynamics Simulation of Subsurface Damage of 6H-SiC Bulk Materials Induced by Grinding with Nano-sized Diamond Particles

GENG Ruiwen¹, YANG Zhijiang², YANG Weihua², XIE Qiming³, YOU Jinjing³, LI Lijun²(

), WU Haihua¹

^1.Hubei Provincial Engineering Research Center for Graphite Additive Manufacturing Technology and Equipment, Three Gorges University, Yichang 443002, China
^2.School of Mechanical and Dynamics, Three Gorges University, Yichang 443002, China
^3.Kunming Institute of Physics, Kunming 650223, China

引用本文:

耿瑞文, 杨志豇, 杨蔚华, 谢启明, 游津京, 李立军, 吴海华. 6H-SiC纳米磨削亚表面损伤机理的分子动力学研究[J]. 材料研究学报, 2025, 39(8): 603-611.
Ruiwen GENG, Zhijiang YANG, Weihua YANG, Qiming XIE, Jinjing YOU, Lijun LI, Haihua WU. Molecular Dynamics Simulation of Subsurface Damage of 6H-SiC Bulk Materials Induced by Grinding with Nano-sized Diamond Particles[J]. Chinese Journal of Materials Research, 2025, 39(8): 603-611.

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摘要:

应用分子动力学模拟磨削硬脆性6H-SiC纳米材料工件时其表面的变形行为，研究了亚表面的损伤机理以及磨粒尺寸和磨削速度的影响。结果表明：磨粒尺寸大于4.9 nm时，随着磨削速度的提高6H-SiC材料的去除率先提高后降低，去除方式以黏附为主。在磨削速度恒定的条件下，随着磨粒尺寸的增大6H-SiC工件亚表面的温度、损伤深度和晶格缺陷程度先降低后提高。磨粒尺寸为5.4 nm时，磨削速度对工件亚表面的损伤深度和磨削力的影响更为显著。对于本文的模拟参数，采用较高的磨削速度和5.4 nm的磨粒加工表面的质量更高。

关键词 ：无机非金属材料, 纳米磨削, 表面质量, 分子动力学模拟, 亚表面损伤, 磨粒尺寸, 磨削速度

Abstract：

In-depth study of the damage mechanism of hard and brittle 6H-SiC materials during the grinding process with nano-particles is of great significance to improving the surface quality of 6H-SiC components. In the article, the surface deformation behavior of the bulk 6H-SiC materials during grinding with nano-diamond abrasives was simulated by means of molecular dynamics simulation, while revealing the subsurface damage mechanism and considering the effects of abrasive grain size and grinding speed. The results show that when the abrasive grain size is larger than 4.9 nm, as the grinding speed increases, the material removal first increases and then decreases, and the removal of 6H-SiC material is primarily based on adhesion. By a constant grinding speed, as the abrasive grain size increases, the damage depth, subsurface temperature, and lattice defect degree of the 6H-SiC workpiece first decrease and then increase. Additionally, the grinding speed has much significant impact on the subsurface damage depth and grinding force of the workpiece, for the abrasive grain size is 5.4 nm. It is expected that by adopting 5.4 nm abrasive grains and setting higher grinding speeds,the higher machined surface quality may be achieved within the simulation parameters range.

Key words： inorganic non-metallic materials nano-grinding surface quality molecular dynamics simulation subsurface damage abrasive grain size grinding speed

收稿日期: 2024-08-19

ZTFLH:

TN304

基金资助:湖北省技术创新专项重大项目(2019AAA164);三峡大学人才引进项目(2022Y0037);水电机械设备设计与维护湖北省重点实验室开放基金(2023KJX04)

通讯作者: 李立军，教授，llj@ctgu.edu.com，研究方向为超精密加工工艺与装备

Corresponding author: LI Lijun, Tel: 15997659483, E-mail: llj@ctgu.edu.com

作者简介: 耿瑞文，男，1993年生

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https://www.cjmr.org/CN/10.11901/1005.3093.2024.355 或 https://www.cjmr.org/CN/Y2025/V39/I8/603

图1 6H-SiC的纳米磨削模拟模型

Parameter	Value
Workpiece dimension Grinding direction	25 nm × 13 nm × 16 nm $1 ¯ 0 0$
Grinding speed / m·s^-1	50、100、200
Grinding depth / nm	0.15
Tool radius / nm	4.9、5.4、5.9
Timestep / ps	0.001
Initial temperature / K	300
Ensemble	NVT, NVE

表1 纳米磨削模拟参数

图2 6H-SiC工件纳米磨削后的表面形貌

图3 6H-SiC工件不同磨削速度和磨粒尺寸研究下的切屑原子数量和非晶原子数量

图4 不同磨削速度和磨粒尺寸条件下6H-SiC工件的亚表面损伤深度

图5 不同磨削速度和磨粒尺寸条件下6H-SiC工件亚表面中的相变

图6 径向分布函数：(a)不同纳米磨削阶段、(b)不同磨削速度、(c)不同磨粒尺寸

图7 不同磨削速度和磨粒尺寸研究下6H-SiC工件的温度分布

图8 不同磨削速度和磨粒尺寸条件下的最大Von Mises应力

图9 不同磨削速度和磨粒尺寸条件下6H-SiC工件的Von Mises应力分布

图10 不同磨削速度和磨粒尺寸条件下的切向磨削力

图11 不同磨削速度和磨粒尺寸条件下的法向磨削力

图12 不同磨削速度和磨粒尺寸条件下6H-SiC工件的摩擦系数

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