6H-SiC纳米磨削亚表面损伤机理的分子动力学研究

doi:10.11901/1005.3093.2024.355

材料研究学报 DOI: 10.11901/1005.3093.2024.355

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6H-SiC纳米磨削亚表面损伤机理的分子动力学研究

耿瑞文¹,杨志豇²,杨蔚华²,谢启明³,游津京³,李立军⁴,吴海华⁵

1. 昆明理工大学
2. 三峡大学
3. 昆明物理研究所
4. 三峡大学机械与动力学院
5. 湖北省宜昌市三峡大学

Molecular Dynamics Study on Subsurface Damage Mechanism of 6H-SiC Nano-grinding

引用本文:

耿瑞文杨志豇杨蔚华谢启明游津京李立军吴海华. 6H-SiC纳米磨削亚表面损伤机理的分子动力学研究[J]. 材料研究学报, 10.11901/1005.3093.2024.355.

全文: PDF(16838 KB)

摘要: 深入研究硬脆性6H-SiC材料在纳米磨削过程中的损伤机理对提高6H-SiC元件的表面质量具有重要意义。本文采用分子动力学方法模拟了6H-SiC纳米磨削中的表面变形行为，同时揭示了亚表面损伤机理,并考虑了磨粒尺寸和磨削速度的影响。结果表明：当磨粒尺寸大于4.9 nm时，随着磨削速度的增大，6H-SiC材料去除率先增大后减小，材料去除方式主要以黏附为主。在恒定的磨削速度下，随着磨粒尺寸的增大，6H-SiC工件的亚表面损伤深度、温度和晶格缺陷程度先减小后增大。此外，当磨粒尺寸为5.4 nm时，磨削速度对工件亚表面损伤深度和磨削力的影响更显著。在本文模拟参数下，采用较高的磨削速度和5.4 nm的磨粒可获得更高的加工表面质量。

关键词 ：纳米磨削, 表面质量, 分子动力学模拟, 亚表面损伤, 磨粒尺寸, 磨削速度

Abstract：In-depth study of the damage mechanism of hard and brittle 6H-SiC materials during the nano-grinding process is of great significance to improving the surface quality of 6H-SiC components. This paper uses molecular dynamics methods to simulate the surface deformation behavior in 6H-SiC nano-grinding, while revealing the subsurface damage mechanism and considering the effects of abrasive grain size and grinding speed. The results show that when the abrasive grain size is larger than 4.9 nm, as the grinding speed increases, the material removal first increases and then decreases, and the removal of 6H-SiC material is primarily based on adhesion. At a constant grinding speed, as the abrasive grain size increases, the subsurface damage depth, temperature, and lattice defect degree of the 6H-SiC workpiece first decrease and then increase. Additionally, the grinding speed has a more significant impact on the subsurface damage depth and grinding force of the workpiece under the abrasive grain size of 5.4 nm. Higher grinding speeds and 5.4 nm abrasive grains can be used to achieve higher machined surface quality within the simulation parameters range.

Key words： Nano-grinding surface quality molecular dynamics simulation subsurface damage abrasive grain size grinding speed.

收稿日期: 2024-08-19

ZTFLH:

TG58

基金资助:湖北省技术创新专项重大项目;三峡大学人才引进项目;水电机械设备设计与维护湖北省重点实验室开放基金

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https://www.cjmr.org/CN/Y0/V/I/0

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