Fabrication of a Three-dimensional Nanoporous Cu-Ti Alloy with Excellent Electrochemical Capacitance Performance

doi:10.11901/1005.3093.2015.12.913

Chinese Journal of Materials Research

2015, Vol. 29

Issue (12): 913-920 DOI: 10.11901/1005.3093.2015.12.913

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Fabrication of a Three-dimensional Nanoporous Cu-Ti Alloy with Excellent Electrochemical Capacitance Performance

Jie LIU^1,^2,³,Xuyan LIU^2,³,Fang LIU^2,³,Fei WANG^1,^2,³,Deng PAN^2,^3,^**(

)

1. School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
2. School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
3. Metal Based Advanced Electric Power Materials Laboratory, University of Shanghai for Science and Technology, Shanghai 200093, China

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Jie LIU,Xuyan LIU,Fang LIU,Fei WANG,Deng PAN. Fabrication of a Three-dimensional Nanoporous Cu-Ti Alloy with Excellent Electrochemical Capacitance Performance. Chinese Journal of Materials Research, 2015, 29(12): 913-920.

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Abstract

Thin film of nanoporous Cu-Ti alloy as a promising electrode material for electrochemical capacitors was prepared by a two-step process, i.e. a thin film of Cu₃₅Ti₆₅was firstly deposited on silicon substrate by magnetron sputtering process with Cu₄₀Ti₆₀ alloy as target , and then the sputtered film of Cu₃₅Ti₆₅ alloy was dealloyed in 0.13 mol/L HF solution for 12 h to prepair the isolated thin film of nanoporous Cu-Ti alloy. Electrodes made of the nanoporous Cu-Ti alloy exhibited excellent electrochemical capacitance performance with a specific capacitance of 8.96 mFcm^-2 in 1 mol/L Na₂SO₄ solution. Furthermore, the nanoporous Cu-Ti alloy electrode showed remarkable chemical stability by cyclically charging and discharging. The excellent electrochemical performance of the nanoporous Cu-Ti alloy can be ascribed to the high specific surface area of the nanoporous structure.

Key words: metal materials nanoporous Cu-Ti magnetron sputtering dealloying electrochemical capacitance electrochemical capacitor

Received: 12 May 2015

Fund: *Supported by the Education Commission Innovation Project of Shanghai No.14YZ082, and the Natural Science Foundation of Science and Technology Commission of Shanghai No.14ZR1428100

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https://www.cjmr.org/EN/10.11901/1005.3093.2015.12.913 OR https://www.cjmr.org/EN/Y2015/V29/I12/913

Table 1 EDAX element analysis for (a) sputtered Cu₃₅Ti₆₅ alloy film, (b) NPCu/Ti alloy film dealloying for 8 h and (c) 12 h (atom fraction, %)

Fig.1 SEM images: (a) section and (b) surface of the Cu₃₅Ti₆₅ alloy, (c) 8 h and 12 h dealloying NPC/Ti and the pore distribution, (e) detail of the 12 h dealloying NPC/Ti

Fig.2 EDAX element analysis for sputtered Cu₃₅Ti₆₅ alloy film (a), NPCu/Ti alloy film dealloyed for 8 h (b) and 12 h (c)

Fig.3 XRD patterns for sputtered Cu₃₅Ti₆₅ alloy film (a), NPCu/Ti alloy film dealloyed for 8 h (b) and 12 h (c) and binary alloy phase diagram for copper-titanium alloy (d)

Table 2 Average specific capacitance of NPCu/Ti dealloyed for 8 h and 12 h at various scan rates (C/mFcm^-1)

Table 3 Comparison of specific capacitance of different nanoporous-material-based capacitors

Fig.4 CV curves for the NPCu/Ti after dealloyed in 0.13 mol/L HF for 8 h and 12 h at a scanning rate of 250 mVs^-1(a), the NPCu/Ti dealloyed for 8 h at various scan rates (b) and the NPCu/Ti dealloy ed for 12 h at various scan rates (c) and area capacitance of NPCu/Ti-8 h and NPCu/Ti-8 h measured as a function of scan rate (d)

Fig.5 Galvanostatic charge-discharge curves of NPCu/Ti-8 h and NPCu/Ti-12 h collected at a current density of 50 μA/cm² (a), NPCu/Ti-8 h collected at various current densities (b) and NPCu/Ti-12 h collected at various current densities (c) and cycle performance of NPC-12 h and G-NPC-12 h at a current density of 50 μA/cm² (d)

Table 4 Average specific capacitance of NPCu/Ti dealloyed for 8 h and 12 h at various current densities (C/mFcm^-1)

Fig.6 Nyquist plots for NPCu/Ti-8 h and NPCu/Ti-12 h electrodes at an open circuit state and the corresponding equivalent circuit in the inset

Table 5 EIS fitting results for NPCu/Ti-8 h and NPCu/Ti-12 h electrodes

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