Preparation and Properties of Organoclay/Polyethersulfone/Epoxy Hybrid Nanocomposites

doi:10.11901/1005.3093.2014.221

Chinese Journal of Materials Research

2014, Vol. 28

Issue (10): 794-800 DOI: 10.11901/1005.3093.2014.221

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Preparation and Properties of Organoclay/Polyethersulfone/Epoxy Hybrid Nanocomposites

Shou MA^1,^2,^**(

),Jianchun GUO¹

1. State Key Laboratory of Oil and Gas Geology and Exploitation, Southwest Petroleum University, Chengdu 637000
2. SINOPEC Shengli Oilfield Company, Dongying 257082

Cite this article:

Shou MA,Jianchun GUO. Preparation and Properties of Organoclay/Polyethersulfone/Epoxy Hybrid Nanocomposites. Chinese Journal of Materials Research, 2014, 28(10): 794-800.

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Abstract

Organoclay/polyethersulphone/epoxy hybrid nanocomposites were prepared by solvent method and melting method, respectively. Their tensile properties, fracture toughness, thermal properties and microstructures were then characterized. Their tensile strength arrived at 75 MPa, modulus reached 2.8GPa, and fracture toughness was over 1.1MPam^1/2. Synergistic toughening effect of the polyethersulphone and organoclay on the epoxy resin was observed. Semi-interpenetrating network of the polyethersulphone/epoxy matrix was found by dynamic mechanical thermal analyzer (DMA) and transmission electron microscope (TEM). The results of X-ray diffractometer (XRD) analysis and TEM observation reveal that the organoclay possessed ordered exfoliated morphologies. Glass transition temperatures (Tgs) of the two hybrid nanocomposites were tested by dynamic mechanical thermal analysis (DMTA). The T_g of the specimen prepared by the solvent method was found higher than 170℃, while that by the melting method was more than 180℃.

Key words: composites hybrid nanocomposite polyethersulphone organoclay fracture toughness microstructure

Received: 28 April 2014

Fund: * Supported by National Science and Technology Major Project No.2011ZX05051.

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https://www.cjmr.org/EN/10.11901/1005.3093.2014.221 OR https://www.cjmr.org/EN/Y2014/V28/I10/794

Fig.1 DMTA curves of Loss tangent vs. temperature for the samples consisting of the neat epoxy resin, PES/epoxy blend, nanocomposites and hybrid nanocomposites

Fig.2 SEM images for the fractured cross-sections of the samples after being rinsed (from (a-1) to (a-6)) and before being rinsed (from (b-1) to (b-6))(All the samples were sufficiently rinsed with methylene chloride) ((a-1), (b-1): organoclay(0%)/PES/epoxy samples cured at 120℃; (a-2), (b-2): organoclay(1%)/PES/epoxy samples cured at 120℃; (a-3), (b-3): organoclay(3%)/PES/epoxy samples cured at 120℃; (a-4), (b-4): organoclay(0%)/PES/epoxy samples cured at 180℃; (a-5), (b-5): organoclay(1%)/PES/epoxy samples cured at 180℃; (a-6), (b-6): organoclay(3%)/PES/epoxy samples cured at 180℃)

Table 1 Tgs of the four groups of samples

Fig.3 TEM micrographs of PES/epoxy blends and neat epoxy resin with homogeneous morphology (A) PES/epoxy blends (cured at 120℃); (B) PES/epoxy blends(cured at 180℃); (C) neat epoxy resin (cured at 120℃)

Fig.4 XRD patterns of prinstine clay, organoclay, nanocomposites and hybrid nanocomposites (A) organoclay(1%)/PES/epoxy sample cured at 120℃; (B) organoclay(3%)/PES/epoxy sample cured at 120℃; (C) organoclay(1%)/PES/epoxy sample cured at 180℃; (D) organoclay(3%)/PES/epoxy sample cured at 180℃; (E) organoclay(1%)/epoxy sample; (F) organoclay(3%)/epoxy sample; (G) pristine clay; (H) organoclay

Fig.5 TEM images of the morphologies of organoclay in the hybrid nanocomposites with 1% organoclay(a), small agglomerates of organoclay(b) and large agglomerates of organoclay) (c, d)

Table 2 XRD data of the hybrid nanocomposites prepared by melting method

Fig.6 TEM images of the morphologies of organoclay in the hybrid nanocomposites with 1% organoclay

Table 3 Tensile testing results of the epoxy resin, PES/epoxy blend and hybrid nanocomposites

Table 4 Fracture toughness of the neat epoxy resins, PES/epoxy blends, nanocomposites and hybrid nanocomposites cured at different temperatutes (K_ICstands for the critical value of Mode-I fracture toughness)

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