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材料研究学报  2026, Vol. 40 Issue (1): 13-22    DOI: 10.11901/1005.3093.2024.498
  研究论文 本期目录 | 过刊浏览 |
紧密排布结构大模组铸造DD5单晶高温合金的凝固组织
刘家宝1,2, 高雪峰2, 张皓宇2, 王亮2, 王延辉3, 乐献刚3, 孟杰2(), 李金国2, 周亦胄2()
1.中国科学技术大学材料科学与工程学院 沈阳 110016
2.中国科学院金属研究所 沈阳 110016
3.沈阳黎明航空发动机(集团)有限责任公司 沈阳 110043
Microstructure of DD5 Single Crystal High-temperature Alloy Prepared via Rapid Solidification Process by Using a Large Module with Dense Array of Seed Crystals
LIU Jiabao1,2, GAO Xuefeng2, ZHANG Haoyu2, WANG Liang2, WANG Yanhui3, YUE Xiangang3, MENG Jie2(), LI Jinguo2, ZHOU Yizhou2()
1.School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China
2.Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
3.Shenyang Liming Aero-Engine (Group) Corporation Ltd., Shenyang 110043, China
引用本文:

刘家宝, 高雪峰, 张皓宇, 王亮, 王延辉, 乐献刚, 孟杰, 李金国, 周亦胄. 紧密排布结构大模组铸造DD5单晶高温合金的凝固组织[J]. 材料研究学报, 2026, 40(1): 13-22.
Jiabao LIU, Xuefeng GAO, Haoyu ZHANG, Liang WANG, Yanhui WANG, Xiangang YUE, Jie MENG, Jinguo LI, Yizhou ZHOU. Microstructure of DD5 Single Crystal High-temperature Alloy Prepared via Rapid Solidification Process by Using a Large Module with Dense Array of Seed Crystals[J]. Chinese Journal of Materials Research, 2026, 40(1): 13-22.

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摘要: 

用高速凝固制备紧密排布结构大模组制备DD5单晶高温合金并在模组中添加石墨隔热材料将其优化,研究了这种单晶的温度场和凝固组织。结果表明,与无隔热材料的模组相比,改进后的模组制备的单晶棒的一次枝晶间距从497 μm减小到378 μm并使γ/γ′共晶相细化,共晶相体积分数从7.0%降低到4.7%,W、Re、Al、Ta等元素的偏析程度有所降低,枝晶干和枝晶间的γ'相平均尺寸有所减小,且枝晶干和枝晶间的γ'相尺寸趋于一致。这表明,改进后的模组能提高高速凝固中的温度梯度和单晶凝固过程中温度场的均匀性,有利于保持单晶凝固过程中固液界面的平直而使凝固组织更均匀致密。

关键词 金属材料单晶高温合金大模组紧密排布结构温度场凝固组织    
Abstract

The DD5 single crystal high-temperature alloy rods were massively prepared via high-speed solidification process by using a large module with dense array of seed crystals. At the same time, graphite insulation rods were appropriately inserted in between the seed crystals so that to optimize the temperature field distribution in the solidification chamber. Then, the solidification microstructure of the prepared single crystal alloys was carefully examined by means of optical microscopy, scanning electron microscopy and electron probe microanalysis, whilst the numerical simulation of the temperature field of solidification chamber was conducted as well. The results showed that, compared with the module without insulation of graphite rods, the initial dendrite spacing of the single crystal rods prepared by the modified module was reduced from 497 μm to 378 μm, and the γ/γ' eutectic phase was refined. The volume fraction of the eutectic phase decreased from 7.0% to 4.7%, the degree of segregation of elements such as W, Re, Al and Ta, and the average size of the γ' phase in the core of the dendrite and between the dendrites were reduced, and the size of the γ' phase between the core and the dendrite tended to be consistent. This indicates that the modified module can increase the temperature gradient during the high-speed solidification process and improve the uniformity of the temperature field of solidification chamber during the single crystal solidification process, which is conducive to maintaining a straight solid-liquid interface during single crystal solidification and making the solidification microstructure much uniform and dense.

Key wordsmetallic materials    single crystal superalloy    large module    dense array structure    temperature field    solidification structure
收稿日期: 2024-12-16     
ZTFLH:  TG132.3+2  
基金资助:国家资助博士后研究人员计划(GZC20232739)
通讯作者: 孟杰,正高级工程师,jmeng@imr.ac.cn,研究方向为高温合金组织和性能控制;
周亦胄,研究员,yzzhou@imr.ac.cn,研究方向为单晶高温合金设计与制备
Corresponding author: MENG Jie, Tel: 18842323031, E-mail: jmeng@imr.ac.cn;
ZHOU Yizhou, Tel: (024)83978068, E-mail: yzzhou@imr.ac.cn
作者简介: 刘家宝,男,2000年生,硕士生
CrCoMoWAlTaReHfYNi
7.07.51.55.06.26.53.00.150.01Bal.
表1  DD5合金的名义成分
图1  不同方案模组模型的示意图
Initial conditionParameter
Melting temperature of DD5 superalloy1520 oC
Temperature of mold1520 oC
Temperature of chill plate40 oC
Boundary condition
Heater temperature1470 oC/1520 oC
Emissivity (ɛ)0.8
Cooler temperature25 oC
Interface heat transfer coefficients
Alloy melt and ceramic shell mold500 W / (m2·K)
Alloy melt and water-cooled chill plate2000 W / (m2·K)
Ceramic shell mold and water-cooled chill plate1000 W / (m2·K)
表2  模拟中使用的初始条件和边界条件
图2  隔热材料中心柱型壳的定向凝固过程随时间变化的模拟和实验温度曲线
图3  两种模组的模拟温度场
图4  两种模组的糊状区模拟结果
图5  无隔热材料的密排大模组浇注的单晶横截面组织形貌
图6  无隔热材料密排大模组浇注的内、外侧DD5单晶棒不同高度的一次枝晶间距
图7  无隔热材料密排大模组浇注DD5合金试棒中的共晶组织
图8  无隔热材料密排大模组浇注的单晶中各元素的偏析系数
图9  无隔热材料密排大模组浇注的单晶枝晶干和枝晶间γ'相的形貌
图10  中心加隔热材料的大模组浇注的单晶的横截面组织形貌
图11  两种不同模组浇注的DD5单晶棒的不同高度的一次枝晶间距
图12  中心加隔热材料的密排大模组浇注DD5合金试棒中共晶组织的形貌
图13  两种模组条件浇注的内侧单晶棒中各元素的偏析系数
图14  中心加隔热材料模组浇注的内侧单晶棒的枝晶干和枝晶间γ'相的形貌
图15  两种型壳浇注单晶的γ'相平均尺寸统计
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