Thermophysical properties and influencing factors of polyimide/silica composite films

Chin J Mater Res

2009, Vol. 23

Issue (6): 587-591 DOI:

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Thermophysical properties and influencing factors of polyimide/silica composite films

YANG Liping¹; CAI An^1;2; LUO Caiyun¹; CHEN Jiangping ²; XI Tonggeng¹

1.Shanghai Institute of Ceramics; Chinese Academy of Sciences (SICCAS); Shanghai 200050
2.Institute of Refrigeration and Cryogenics; Shanghai Jiao Tong University; Shanghai 200240

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YANG Liping CAI An LUO Caiyun CHEN Jiangping XI Tonggeng. Thermophysical properties and influencing factors of polyimide/silica composite films. Chin J Mater Res, 2009, 23(6): 587-591.

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Abstract

Thermal diffusivities, thermal conductivities, and specific heats of PI film and PI/SiO₂ composite film at different temperatures were measured by laser flash method and differential scanning calorimeter(DSC). The light transmission problem of thin films in the procession of testing thermal diffusivity by laser flash method was solved effectively. The influences of temperature and silica content on
thermophysical properties of PI/SiO₂ composite films were investigated. The results showed that thermal diffusivities of PI and PI/SiO₂decreased, and specific heats and thermal conductivities increased with increasing temperature. The addition of the silica could result in the decrease of specific heats and the obvious enhancement of thermal conductivities, but the trend that the thermal conductivity of PI film
increases with increasing temperature would not be changed, which is inherent in amorphous materials.

Key words: composite material thermophysical properties laser flash method PI/SiO₂ thin film

Received: 17 March 2009

ZTFLH:

TB332

Fund:

Supported by National Nature Science Foundtion of China No.50706057.

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	YANG Li-Ping
	SA An
	LUO Cai-Yun
	CHEN Jiang-Beng
	XI Tong-Geng

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https://www.cjmr.org/EN/ OR https://www.cjmr.org/EN/Y2009/V23/I6/587

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