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| Effect of Pulse Period and Saccharin Additive on Microstructure of Ni Electrodeposits |
| ZHENG Liangfu, PENG Xiao, WANG Fuhui |
| State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 |
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Cite this article:
ZHENG Liangfu PENG Xiao WANG Fuhui. Effect of Pulse Period and Saccharin Additive on Microstructure of Ni Electrodeposits. Chin J Mater Res, 2010, 24(5): 501-507.
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Abstract The effects of pulse period and saccharin additive on the microstructure of Ni films electrodeposited using pulse power from a conventional nickel sulphate bath have been investigated by SEM, XRD and TEM. The results show that, 1) an increase of pulse period during pulse electrodeposition favors to deposit a finer grained Ni film with increased homogeneity in the deposition orientations along <111>, <200> and <220>; 2) addition of saccharin during the pulse electrodeposition helps to significantly decrease the tensile growth stress, preventing Ni deposits from cracking; 3) an increase of pulse reverse period during pulse reverse electrodeposition causes a gradual evolution in the growth texture of Ni film from first appearance, subsequent disappearance and final appearance of <200> dominant orientation.
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Received: 17 June 2010
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[1] G Palumbo, D M Doyle, A M El-Sherik, U Erb, K T Aust, Intercrystalline hydrogen transport in nanocrystalline nickel, Scr. Metll. Mater., 25, 679(1991).
[2] U Erb, A M El-Sherik, nanocrystalline materials and process of producing the same, US Patent 5, 352, 266(1994).
[3] A M El-Sherik, U Erb, Synthesis of bulk nanocrystalline nickel by pulsed electrodeposition, J. Mater. Sci., 30, 5743(1995).
[4] U Erb, Electrodeposited nanocrystals: Synthesis, properties and industrial applications, Nanostruct. Mater., 6, 533(1995).
[5] H Natter, M Schmelzer, R Hempelmann, Nanocrystalline nickel and nickel-copper-alloys: Synthesis, characterization and thermal stability, J. Mater. Res., 13, 1186(1998).
[6] A Robertson, U Erb, G Palumbo, Practical applications for electrodeposited nanocrystalline materials, NanoStr. Mater., 12, 1035(1999).
[7] I Baskaran, T S N Sankara Narayanan, A Stephen., Pulsed electrodeposition of nanocrystalline Cu-Ni alloy films and evaluation of their characteristic properties, Mater. Let., 60, 1990(2006).
[8] A Marlot, P Kern, D Landolt., Pulse plating of Ni-Mo alloys from Ni-rich electrolytes, Electro. Acta, 48, 29(2002).
[9] R T C Choo, J M Toguri, A M El-Sherik, et al. Mass transfer and electrocrystallization analyses of nanocrystalline nickel production by pulse plating, J. Appl. Electrochem., 25, 384(1995).
[10] Y Zhang, X Peng, F Wang, Development and oxidation at 800 oC of a novel electrodeposited Ni-Cr nanocomposite film, Mater. Let., 58, 1134(2004).
[11] X Peng, T Li, W Wu, et al. Effect of La2O3 particles on microstructure and cracking-resistance of NiO scale on electrodeposited nickel films, Mater. Sci. Eng., A298, 100(2001).
[12] Y Zhou, X Peng, F Wang, Oxidation of a novel electrodeposited Ni-Al nanocomposite film at 1050 oC, Scr. Mater., 50, 1429(2004).
[13] S Kaja, H W Pickering, W R Bitler, Effect of pH on the microstructure of nickel electrodeposits – A TEM Study, Plat. Surf. Fin., 73, 58(1986).
[14] S Shriram, S Mohan, N G Renganathan, et al. R Venkatachalam, Electrodeposition of nanocrystalline nickel - a brief review, Trans. IMF., 78, 194(2000).
[15] R Weil, H C Cook, Electron-microscopic observations of the structure of electroplated nickel, J. Electrochem. Soc., 109, 295(1962).
[16] A G McCormark, M J Oomeroy, V J Cunnane, Microstructural Development and Surface Characterization of Electrodeposited Nickel/Yttria Composite Coatings, J. Electrochem. Soc., 150, C356(2003).
[17] X Peng, J Yan, C Xu, et al. Oxidation at 900 oCof the chromized coatings on A3 carbon steel with the electrodeposition pretreatment of Ni or Ni-CeO2 film, Metall. Mater. Trans., A39, 119(2008).
[18] J Labell, A Zagofsky, S Pearman, Cu K?2 elimination algorithm, J. Appl. Cryst., 8, 499(1975).
[19] M Paunovic, M Schlesinger, Fundamentals of Electrochemical Deposition, Electrochemical Society Series, 1998.
[20] W Kim, R Weil, Pulse plating effects in nickel electrodeposition, Surf. Coat. Technol., 38, 289(1989).
[21] F A Doljack, R W Hoffman, The origins of stress in thin nickel films, Thin Solid Films, 12, 71(1972).
[22] N S Qu, D Zhu , K C Chan, et al. Pulse electrodeposition of nanocrystalline nickel using ultra narrow pulse width and high peak current density, Surf. Coat. Technol., 168, 123(2003).
[23] A Bhandari, S J Hearne, B W Sheldon, S K Soni, Microstructural Origins of Saccharin-Induced Stress Reduction in Electrodeposited Ni, J. Electrochem. Soc., 156, D279(2009).
[24] Y Nakamura, N Kaneko, M Watanabe, H Nezu, Effect of saccharin and aliphatic-alcohols on the electrocrystallization of nickel, J. Appl. Electrochem., 24, 227(1994).
[25] J P Bonino, P. Pouderoux, C. Rossignol, A. Rousset, Effect of saccharin addition on the physicochemical characteristics of deposists from electrolytic nickel-phosphorus baths, Plat. Surf. Fin., 78, 62(1992).
[26] H P Klug, L E Alexander, X-ray diffraction procedures for polycrystalline and amorphous materials, Wiley, New York, 1974: 661.
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