Preparation and Properties of Curd Polyimide Modified by Oligomeric Polyimide

doi:10.11901/1005.3093.2024.276

Chinese Journal of Materials Research

2025, Vol. 39

Issue (2): 103-112 DOI: 10.11901/1005.3093.2024.276

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Preparation and Properties of Curd Polyimide Modified by Oligomeric Polyimide

ZHU Guohao, CHEN Ping(

), XU Jilei, SUN Huimin

State Key Laboratory of Fine Chemicals, School of Chemical Engineering, Dalian University of Technology, Dalian 116024, China

Cite this article:

ZHU Guohao, CHEN Ping, XU Jilei, SUN Huimin. Preparation and Properties of Curd Polyimide Modified by Oligomeric Polyimide. Chinese Journal of Materials Research, 2025, 39(2): 103-112.

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Abstract

A novel oligomeric polyimide (SPI) incorporated with Cardo structures, flexible siloxane bonds, and phenylethynyl terminations was designed and synthesized. Then, the prepared SPI was blended with polyimide (PI) matrix in different proportions to produced SPI modified PI polymer. Upon curing, the SPI modified PI polymer exhibited significant improvements in thermal and mechanical properties. The glass transition temperature (T_g) of the cured blends increased from 382 ^oC for the PI matrix to 459 ^oC. Correspondingly, the tensile strength and tensile modulus were improved from 96.25 MPa and 1.83 GPa to 128.96 MPa and 2.41 GPa respectively. The enhanced thermal stability and mechanical performance of the modified PI may be attributed to the synergistic effects between the siloxane structures with the semi-interpenetrating polymer network (semi-IPNs) formed during the thermal crosslinking process.

Key words: organic polymer materials polyimide thermal -crosslinking semi-IPNs thermal stability mechanical property

Received: 15 June 2024

ZTFLH:

TB324

Fund: Liaoning Revitalization Talents Program(XLYC1802085);National Natural Science Foundation of China(51873109);Dalian Science and Technology Innovation Fund Project(2019J11CY007)

Corresponding Authors: CHEN Ping, Tel: (0411)84986100, E-mail: pchen@dlut.edu.cn

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	ZHU Guohao
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	XU Jilei
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https://www.cjmr.org/EN/10.11901/1005.3093.2024.276 OR https://www.cjmr.org/EN/Y2025/V39/I2/103

Fig.1 Synthesis route of SPI (a), PI (b) and physical image of cured PI polymer film modified by SPI (c)

Fig.2 FTIR spectra of nitro monomer BPFPS and diamine monomer APFPS (a) and ¹H NMR spectrum of APFPS (b)

Fig.3 ¹H NMR spectrum (a) and ¹H NMR spectrum (b) of SPI

Fig.4 FTIR spectra of uncured PI polymer film modified by SPI (a), FTIR spectra in the range of 2100~2300 cm^-1 showcasing the pheny-lethynyl groups (b) and FTIR spectra of cured PI polymer film modified by SPI (c)

Fig.5 WAXD curves of SPI and uncured PI polymer film modified by SPI (a) and WAXD curves of cured PI polymer film modified by SPI (b)

Fig.6 DSC curves of (a) and T_gvs composition curves of the uncured PI polymer film modified by SPI (b)

Table 1 Summary of T_g test values and theoretical calculation results of uncured PI polymer film modified by SPI (^oC)

Fig.7 Thermal crosslinking process

Fig.8 DSC (a) and DSC in the range of 280~450 ^oC (b), DMA (c), TGA (d) and DTG (e) curves of cured PI polymer film modified by SPI

Table 2 Thermal properties of cured PI polymer film modified by SPI (^oC)

Table 3 Mechanical properties of cured PI polymer film modified by SPI

Fig.9 SEM images of cured PI polymer film modified by SPI.Cured SPI/PI-0 (a), cured SPI/PI-5 (b), cured SPI/PI-10 (c), cured SPI/PI-15 (d)

Fig.10 Water contact angle plots for cured PI polymer film modified by SPI

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