Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method

doi:10.11901/1005.3093.2013.880

Chinese Journal of Materials Research

2014, Vol. 28

Issue (5): 321-324 DOI: 10.11901/1005.3093.2013.880

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Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method

Jinshan HE,Hailong ZHANG,Yang ZHANG,Jianwei LI,Xitao WANG(

)

State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083

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Jinshan HE,Hailong ZHANG,Yang ZHANG,Jianwei LI,Xitao WANG. Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method. Chinese Journal of Materials Research, 2014, 28(5): 321-324.

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Abstract

The Cu/diamond composites containing 90% (volume fraction) diamond particles were prepared at 1200°C under a pressure of 5 GPa by high pressure liquid infiltration method, giving a measured thermal conductivity of 662 Wm^-1K^-1. The characterization of composites by means of SEM, EDS and XRD shows that the interfacial bonding of Cu/diamond is strong, and a transition layer exists between diamond and Cu. Besides, some diamond particles are found to be inter-connected. The Cu/diamond composites fabricated by this method exhibited a thermal conductivity far superior to those produced by other means.

Key words: composites thermal conductivity high pressure liquid infiltration Cu/diamond

Received: 20 November 2013

Fund: *Supported by the National Natural Science Foundation of China No. 51271017, and Fundamental Research Funds for the Central Universities No. FRF-TP-13-033A.

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	Jinshan HE
	Hailong ZHANG
	Yang ZHANG
	Jianwei LI
	Xitao WANG

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https://www.cjmr.org/EN/10.11901/1005.3093.2013.880 OR https://www.cjmr.org/EN/Y2014/V28/I5/321

Fig.1 Temperature processing graft for fabricating copper/diamond composites

Fig.2 XRD spectra of the copper/diamond composites

Fig.3 Surface microstructure of the copper/diamond composites (a) backscattered electron photograph, (b) SEM photograph, and (c) element line scan

Fig.4 SEM images of fractured surfaces of the copper/diamond composites: (a) low magnification, (b) high magnification

Fig.5 Element line scanning results for interface of the copper/diamond composites: (a) the detected area of EDS, (b) the distribution of elements

Fig.6 Comparison of thermal conductivity for copper/diamond composites fabricated with different methods. The dotted line represents the value predicted by the H-J model. LI: liquid infiltration, HP: hot pressing, SPS: spark plasma sintering, HPLI: high pressure liquid infiltration

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