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Fabrication and sintering of Pt electrode deposited by screen printing method |
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Cite this article:
;. Fabrication and sintering of Pt electrode deposited by screen printing method. Chin J Mater Res, 2008, 22(5): 479-484.
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Abstract Single layer and double layer Pt bottom electrodes for functional ceramic thick films have been screen printed on alumina substrates. The effects of sintering temperature, heating rate, and thickness of the Pt electrode layer on the pattern, alumina surface coverage, and the roughness of the electrode layer have been studied. The mechanism of grain and pore growth and densification of the Pt layer is also demonstrated. The difference in activation energy and the diffusion can be due to the presence of carbon impurities, whick influences the diffusion of Pt at low temperatures. As the first layer sintered at 600℃, the double print Pt layers with sequential heat treatments at 1200℃ exhibt improved densification and surface coverage. The double print Pt layers with the minimum average roughness of 0.82μm and the smallest sheet resistivity of 0.044have been produced on alumina substrates.
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Received: 16 January 2008
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1 L.D.Madsen,L.Weaver,Examination of barrier layers for lead zirconate titanate thin films,J.Electron. Mater., 21(1),93(1992) 2 J.Collier,I.A.Cornejo,M.J.Haun,Ferroelectric thick-films for piezoelectric applications,Ferroelectrics, 154(1-4), 47(1994) 3 L.Simon,S.Le Dren,P.Gonnard,G.Pierre,Processing and characterization of PbTiO_3 thick films on alumina sub- strates,J.Electroceram,8(3),215(2002) 4 J.G.E.Gardeniers,A.Smith,C.Cobianu,Characterization of sol-gel PZT films on Ptocoated substrates,J.Mi- cromech.Microeng.,5(2),153(1995) 5 F.H.Huang,L.Che-Yu,Ripening of platinum particles on aluminium oxide,Scripta Metall.,7(12),1239(1973) 6 K.T.Miller,F.F.Lange,D.B.Marshall,The instability of polycrystalline thin films:Experiment and theory,J. Mater.Res.,5(1),151(1990) 7 J.B.Vechembre,G.R.Fox,Sintering of screen-printed plat- inum thick films for electrode applications,J.Mater.Res., 16(4),922(2001) 8 SONG Zhitang,REN Wei,WU Xiaoqing,ZHANG Liangying,YAO Xi,Effect of annealing temperatures on phases and microstructures of Pt and Pt/Ti bottom elec- trodes for ferroelectric thin films,Chinese Journal of Ma- terials Research,11(4),363(1997) (宋志棠,任巍,吴小清,张良莹,姚熹,热处理温度对铁电薄膜底电极Pt和Pt/Ti物相与形貌的影响,材料研究学报,11(4),363(19971) 9 W.W.Jung,S.K.Choi,S.Y.Kweon,S.J.Yeom,Platinum (100) hillock growth in Pt/Ti lectrode stack for SrBi_2Ta_2O_9 ferroelectric random access memory,J.Elec- troceram,13(1-3),55(2004) 10 K.Lucke,K.Detert,A quantitative theory of grain bound- ary motion and recrystallization in metals in the presence of impurities,Acta Metall.,5(11),628(1957) 11 R.E.Hoffman,D.Turnbull,Lattice and grain boundary self-diffusion in silver,J.Appl.Phys.,22(5),634(1951) 12 W.D.Kingery,H.K.Bowen,C.A.Goodwin,Phase bound- aries,phase separation and electrical properties of metal oxide crystalline solutions,Am.Ceram.Soc.Bull.,52(8), 632(1973) 13 M.McLean,E.D.Hondros,A study of grain-boundary grooving at the platinum/alumina interface,J.Mater. Sci.,6(1),19(1971) 14 W.E.Mustain,H.Kim,S.Prakash,J.Stark,T.Osborn, P.A.Kohl,Platinum-glass composite electrode for fuel cell applications,Electrochemical and Solid-State Letters, 10(12),210(2007) 15 Y.S.Yoon,S.H.Kim,S.-J.Lee,H.K.Kim,M.-J.Lee,Fabri- cation and frequency response of dual-element ultrasonic transducer using PZT-5A thick film,Sensor Actuat.A, 125(2),463(2006) 16 K.Yao,X.He,Y.Xu,M.Chen,Screen-printed piezoelec- tric ceramic thick films with sintering additives intro- duced through a liquid-phase approach,Sensor Actuat. A,118(2),342(2005) |
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