THE COPOLYIMIDE WITH IMPROVED ADHESION

Chin J Mater Res

1990, Vol. 4

Issue (5): 458-463 DOI:

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THE COPOLYIMIDE WITH IMPROVED ADHESION

LIU Runshan;HU Zhenlun;LI Hong(Hu bei Research Institute of Chemisitry)

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LIU Runshan;HU Zhenlun;LI Hong(Hu bei Research Institute of Chemisitry). THE COPOLYIMIDE WITH IMPROVED ADHESION. Chin J Mater Res, 1990, 4(5): 458-463.

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Abstract To improve adhesion of the polyimide(PI),the copolyamic acids(CPAA)were prepared,and an OB′B(ODA-BTDA-BOPDPA)was selected.The effects of com-ponents of monomers,molecular weight of CPAA and its blends,imidization temperature(Ti)as well as solvents on the

Key words: increasing adhesion copolyimide blend copolyamic acid thermal imidization.

Received: 25 October 1990

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